MT48LC2M32B2TG-6:G Micron Technology Inc, MT48LC2M32B2TG-6:G Datasheet - Page 56
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MT48LC2M32B2TG-6:G
Manufacturer Part Number
MT48LC2M32B2TG-6:G
Description
DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC2M32B2TG-6G.pdf
(69 pages)
Specifications of MT48LC2M32B2TG-6:G
Density
64 Mb
Maximum Clock Rate
166 MHz
Package
86TSOP-II
Address Bus Width
13 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|7.5|5.5 ns
Operating Temperature
0 to 70 °C
Organization
2Mx32
Address Bus
13b
Access Time (max)
17/7.5/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC2M32B2TG-6:G
Manufacturer:
MT
Quantity:
20 000
Figure 38:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
Single READ
DQML, DQMH
COMMAND
BA0, BA1
Notes:
DQM /
A0-A9
CKE
A10
CLK
DQ
t CMS
t CKS
t AS
t AS
t AS
1. For this example, BL = 1, CL = 2, and the READ burst is followed by a “manual” PRECHARGE.
2. A8, A9 = “Don’t Care.”
ACTIVE
T0
ROW
ROW
BANK
t CKH
t CMH
t AH
t AH
t AH
t RCD
t RAS
t RC
t CK
T1
NOP
DISABLE AUTO PRECHARGE
t CMS
t CL
COLUMN m 2
T2
BANK
READ
t CH
t CMH
CAS Latency
56
SINGLE BANK
PRECHARGE
ALL BANKS
BANK
T3
t LZ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t RP
t AC
T4
NOP
D
OUT
t OH
t HZ
m
BANK
ROW
T5
ROW
ACTIVE
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
DON’T CARE
UNDEFINED
Timing Diagrams