MT48LC16M16A2TG-75:D Micron Technology Inc, MT48LC16M16A2TG-75:D Datasheet - Page 66

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MT48LC16M16A2TG-75:D

Manufacturer Part Number
MT48LC16M16A2TG-75:D
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M16A2TG-75:D

Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M16A2TG-75:D
Manufacturer:
MICRON
Quantity:
8 000
Part Number:
MT48LC16M16A2TG-75:D TR
Manufacturer:
MT
Quantity:
210
Figure 37: WRITE – Continuous Page Burst
Command
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
BA0, BA1
Address
DQM
CKE
A10
CLK
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
Bank
T0
Row
Row
t CKH
t CMH
t AH
t AH
t AH
t RCD
Notes:
t CL
T1
NOP
t CH
1.
2. Page left open; no
t
WR must be satisfied prior to issuing a PRECHARGE command.
t CMS
t CK
t DS
Column m
D
WRITE
T2
Bank
IN
t CMH
t DH
t DS
T3
t
NOP
D
RP.
IN
t DH
66
t DS
T4
NOP
D
IN
All locations within same row
t DH
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Full page completed
t DS
T5
NOP
D
IN
t DH
256Mb: x4, x8, x16 SDRAM
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t DS
Tn + 1
NOP
D
IN
© 1999 Micron Technology, Inc. All rights reserved.
Full-page burst
does not self-terminate.
Use BURST TERMINATE
command to stop. 1, 2
t DH
WRITE Operation
BURST TERM
Tn + 2
Don’t Care
Tn + 3
NOP

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