MT48LC16M16A2TG-75:D Micron Technology Inc, MT48LC16M16A2TG-75:D Datasheet - Page 15

• Manufacturer Part Number: MT48LC16M16A2TG-75:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2TG-75:D

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Package Dimensions
Figure 7: 54-Pin Plastic TSOP (400 mil)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
0.15
2X R 0.75
2X R 1.00
PIN #1 ID
+0.03
-0.02
Notes:
10.16 ±0.08
11.76 ±0.20
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. 2X means the notch is present in two locations (both ends of the device).
0.25mm per side.
2.80
2X 0.10
2X 0.71
SEE DETAIL A
22.22 ±.08
15
0.10
+0.10
-0.05
Micron Technology, Inc. reserves the right to change products or specifications without notice.
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn
PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC
PACKAGE WIDTH AND LENGTH DO NOT
INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
1.2 MAX
0.10
0.375 ±0.075 TYP
0.80 TYP
(FOR REFERENCE
ONLY)
0.50 ±0.10
256Mb: x4, x8, x16 SDRAM
Package Dimensions
DETAIL A
© 1999 Micron Technology, Inc. All rights reserved.
GAGE PLANE
0.80
0.25