MT48LC16M16A2P-75 IT:D Micron Technology Inc, MT48LC16M16A2P-75 IT:D Datasheet - Page 16

• Manufacturer Part Number: MT48LC16M16A2P-75 IT:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-75 IT:D

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: -40 to 85 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 8: 60-Ball FBGA "FB" (8mm x 16mm) (x4, x8)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60X Ø 0.45
8.00 ±0.05
5.60
Notes:
BALL
A8
0.155 ±0.013
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
16
SEATING PLANE
0.10 A
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
256Mb: x4, x8, x16 SDRAM
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID