MBT3904DW1T1G ON Semiconductor, MBT3904DW1T1G Datasheet - Page 8

• Manufacturer Part Number: MBT3904DW1T1G
• Description: TRANS DUAL GP 200MA 40V SC88
• Manufacturer: ON Semiconductor

Specifications of MBT3904DW1T1G

• Transistor Type: 2 NPN (Dual)
• Current - Collector (ic) (max): 200mA
• Voltage - Collector Emitter Breakdown (max): 40V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 5mA, 50mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 100 @ 10mA, 1V
• Power - Max: 150mW
• Frequency - Transition: 300MHz
• Mounting Type: Surface Mount
• Package / Case: SC-70-6, SC-88, SOT-363
• Configuration: Dual
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 40/40 V
• Emitter- Base Voltage Vebo: 6 V
• Continuous Collector Current: - 2 A
• Maximum Dc Collector Current: 0.2 A
• Power Dissipation: 625 mW
• Maximum Operating Frequency: 300 MHz
• Maximum Operating Temperature: + 150 C
• Dc Collector/base Gain Hfe Min: 40 at 0.1 mA at 1 V
• Minimum Operating Temperature: - 55 C
• Collector Emitter Voltage V(br)ceo: 40V
• Transition Frequency Typ Ft: 300Hz
• Power Dissipation Pd: 150mW
• Dc Collector Current: 200mA
• Dc Current Gain Hfe: 300
• No. Of Pins: 6
• Rohs Compliant: Yes
• Module Configuration: Dual
• Number Of Elements: 2
• Collector-emitter Voltage: 40V
• Collector-base Voltage: 60V
• Emitter-base Voltage: 6V
• Collector Current (dc) (max): 200mA
• Frequency (max): 300MHz
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 6
• Package Type: SOT-363
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MBT3904DW1T1GOSTR

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H
E
A1
6
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
5
2
e
4
3
A
−E−
b
*For additional information on our Pb−Free strategy and soldering
0.0157
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
6 PL
0.2 (0.008)
M
0.0197
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
0.50
SOT−363/SC−88/SC70−6
SOLDERING FOOTPRINT*
A3
E
M
http://onsemi.com
CASE 419B−02
L
ISSUE W
0.0748
8
1.9
C
SCALE 20:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
Y14.5M, 1982.
DIM
H
STYLE 1:
A1
A3
A
C
D
E
b
e
L
E
PIN 1. EMITTER 2
inches
mm
0.025
0.025
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
0.65
0.65
MIN
0.80
0.00
0.10
0.10
1.80
1.15
0.10
2.00
MILLIMETERS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.65 BSC
0.20 REF
NOM
0.95
0.05
0.21
0.14
2.00
1.25
0.20
2.10
MAX
1.10
0.10
0.30
0.25
2.20
1.35
0.30
2.20
0.031
0.000
0.004
0.004
0.070
0.045
0.004
0.078
MIN
STYLE 27:
MBT3904DW1T1/D
PIN 1. BASE 2
0.026 BSC
0.008 REF
INCHES
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
0.037
0.002
0.008
0.005
0.078
0.049
0.008
0.082
NOM
0.043
0.004
0.012
0.010
0.086
0.053
0.012
0.086
MAX