PMP5201Y,135 NXP Semiconductors, PMP5201Y,135 Datasheet

TRANS MATCHED PNP SOT-363

PMP5201Y,135

Manufacturer Part Number
PMP5201Y,135
Description
TRANS MATCHED PNP SOT-363
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMP5201Y,135

Transistor Type
2 PNP (Dual)
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
45V
Vce Saturation (max) @ Ib, Ic
400mV @ 5mA, 100mA
Dc Current Gain (hfe) (min) @ Ic, Vce
200 @ 2mA, 5V
Power - Max
300mW
Frequency - Transition
175MHz
Mounting Type
Surface Mount
Package / Case
SC-70-6, SC-88, SOT-363
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Other names
934059041135
PMP5201Y /T3
PMP5201Y /T3
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic
packages. The transistors in the SOT666 and SOT363 (SC-88) packages are fully isolated
internally.
Table 1.
I
I
I
I
I
I
Table 2.
Type number
PMP5201V
PMP5201G
PMP5201Y
Symbol
Per transistor
V
I
h
C
FE
CEO
PMP5201V; PMP5201G;
PMP5201Y
PNP/PNP matched double transistors
Rev. 03 — 28 August 2009
Current gain matching
Base-emitter voltage matching
Common emitter configuration for SOT353 types
Application-optimized pinout
Current mirror
Differential amplifier
Product overview
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
Package
NXP
SOT666
SOT353
SOT363
JEITA
-
SC-88A
SC-88
Conditions
open base
V
I
C
CE
= 2 mA
= 5 V;
PNP/PNP h
0.95 complement
PMP5501V
PMP5501G
PMP5501Y
Min
-
-
200
FE1
/h
FE2
Typ
-
-
290
Product data sheet
NPN/NPN
complement
PMP4201V
PMP4201G
PMP4201Y
Max
450
45
100
Unit
V
mA

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PMP5201Y,135 Summary of contents

Page 1

PMP5201V; PMP5201G; PMP5201Y PNP/PNP matched double transistors Rev. 03 — 28 August 2009 1. Product profile 1.1 General description PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors in the SOT666 and SOT363 (SC-88) packages are ...

Page 2

... NXP Semiconductors Table 2. Symbol Per device h /h FE1 FE2 V V BE1 [1] The smaller of the two values is taken as the numerator. [2] The smaller of the two values is subtracted from the larger value. 2. Pinning information Table 3. Pin SOT666; SOT363 SOT353 Ordering information Table 4. Type number ...

Page 3

... NXP Semiconductors 4. Marking Table 5. Type number PMP5201V PMP5201G PMP5201Y [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device ...

Page 4

... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified. amb Symbol Per transistor ...

Page 5

... NXP Semiconductors Table unless otherwise specified. amb Symbol Per device h /h FE1 FE2 V V BE1 [1] V BEsat [ [3] The smaller of the two values is taken as the numerator. [4] The smaller of the two values is subtracted from the larger value. PMP5201V_G_Y_3 Product data sheet PMP5201V; PMP5201G; PMP5201Y Characteristics … ...

Page 6

... NXP Semiconductors 0.20 I (mA (A) 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 1.1 0.9 (1) (2) 0.7 (3) 0.5 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current; typical values PMP5201V_G_Y_3 Product data sheet PMP5201V ...

Page 7

... NXP Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values PMP5201V_G_Y_3 Product data sheet PMP5201V; PMP5201G; PMP5201Y 006aaa544 f (MHz (mA) C Fig 6. 006aaa546 C (pF (V) CB Fig 8. Rev. 03 — 28 August 2009 ...

Page 8

... NXP Semiconductors 8. Application information TR1 006aaa524 Fig 9. Current mirror 9. Package outline 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 1 2 0.5 1 Dimensions in mm Fig 11. Package outline SOT666 Fig 13. Package outline SOT363 (SC-88) PMP5201V_G_Y_3 Product data sheet PMP5201V; PMP5201G; PMP5201Y l out TR2 Fig 10. Differential amplifier ...

Page 9

... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PMP5201V PMP5201G PMP5201Y [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering 2 1.7 Fig 14. Refl ...

Page 10

... NXP Semiconductors Fig 15. Reflow soldering footprint SOT353 (SC-88A) 0.85 4.5 0.85 Fig 16. Wave soldering footprint SOT353 (SC-88A) PMP5201V_G_Y_3 Product data sheet PMP5201V; PMP5201G; PMP5201Y 2.35 solder lands 0. solder paste solder resist occupied area Dimensions in mm 4.9 2. 1.3 1.3 1.225 1.225 Dimensions in mm Rev. 03 — ...

Page 11

... NXP Semiconductors Fig 17. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 18. Wave soldering footprint SOT363 (SC-88) PMP5201V_G_Y_3 Product data sheet PMP5201V; PMP5201G; PMP5201Y 2.65 1.5 2.35 0 1.8 1.3 1.3 2.45 5.3 Rev. 03 — 28 August 2009 PNP/PNP matched double transistors ...

Page 12

... Release date PMP5201V_G_Y_3 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 14 “Reflow soldering footprint SOT666” • ...

Page 13

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 14

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Legal information ...

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