BCV63B,215 NXP Semiconductors, BCV63B,215 Datasheet
BCV63B,215
Specifications of BCV63B,215
BCV63B T/R
BCV63B T/R
Related parts for BCV63B,215
BCV63B,215 Summary of contents
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BCV63; BCV63B NPN general-purpose double transistors Rev. 4 — 4 August 2010 1. Product profile 1.1 General description NPN general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package. Table 1. Type number BCV63 BCV63B 1.2 Features and ...
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... NXP Semiconductors Table 2. Symbol Transistor TR2 V CEO h FE [1] Group selection will be done on TR1. Due to matched dies Pinning information Table 3. Pin Ordering information Table 4. Type number BCV63 BCV63B 4. Marking Table 5. Type number BCV63 BCV63B [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V EBO Transistor TR1 V CBO V CEO Transistor TR2 V CBO V CEO Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB). 6. Thermal characteristics Table 7 ...
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... NXP Semiconductors 7. Characteristics Table 8. Symbol Parameter Per transistor I CBO V CEsat V BEsat Transistor TR1 CEsat V BEsat Transistor TR2 CEsat V BE [1] Group selection will be done on TR1. Due to matched dies, h [2] V BEsat [ BCV63_63B Product data sheet Characteristics C unless otherwise specified. Conditions collector-base cut-off current ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 1. BCV63B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 C (1) T amb = 25 C (2) T amb = ...
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... NXP Semiconductors 8. Application information Fig 5. 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. BCV63_63B Product data sheet ...
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... NXP Semiconductors 10. Package outline Fig 6. 11. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BCV63 BCV63B [1] For further information and the availability of packing methods, see BCV63_63B Product data sheet 4 2.5 1.4 2 ...
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... NXP Semiconductors 12. Soldering 0.7 (3×) 0.7 Fig 7. 4.6 Fig 8. BCV63_63B Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 Reflow soldering footprint SOT143B 4.45 2.2 2.575 1.2 Wave soldering footprint SOT143B All information provided in this document is subject to legal disclaimers. ...
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... Release date BCV63_63B v.4 20100804 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1 “Product • Section 3 “Ordering • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 15. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 10 Package outline ...