PMP5501G,135 NXP Semiconductors, PMP5501G,135 Datasheet - Page 9

• Manufacturer Part Number: PMP5501G,135
• Description: TRANS MATCHED PNP SOT-353
• Manufacturer: NXP Semiconductors

Specifications of PMP5501G,135

• Transistor Type: 2 PNP (Dual)
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 45V
• Vce Saturation (max) @ Ib, Ic: 400mV @ 5mA, 100mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2mA, 5V
• Power - Max: 300mW
• Frequency - Transition: 175MHz
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Other names: 934059021135; PMP5501G /T3; PMP5501G /T3

NXP Semiconductors
10. Packing information
11. Soldering
PMP5501V_G_Y_3
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package Description
PMP5501V
PMP5501G
PMP5501Y
Fig 14. Reflow soldering footprint SOT666
2
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
1.7
1.075
Reflow soldering is the only recommended soldering method.
Packing methods
0.538
PMP5501V; PMP5501G; PMP5501Y
SOT666
SOT353
SOT363
0.55
(2 )
Rev. 03 — 28 August 2009
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
0.45
(4 )
(4 )
0.5
2.75
2.45
2.1
1.6
1.7
0.65
(2 )
(2 )
0.6
PNP/PNP matched double transistors
(6 )
0.4
0.325
0.25
(2 )
(4 )
Section
[2]
[3]
0.375
(2 )
(4 )
0.3
[1]
Packing quantity
3000 4000 8000 10000
-
-
-115
-115
-125
14.
Dimensions in mm
-
-115
-
-
-
© NXP B.V. 2009. All rights reserved.
-315
-
-
-
-
solder lands
placement area
solder paste
occupied area
sot666_fr
-
-
-135
-135
-165
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