PUMX2,125 NXP Semiconductors, PUMX2,125 Datasheet
PUMX2,125
Specifications of PUMX2,125
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PUMX2,125 Summary of contents
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PUMX2 NPN/NPN general-purpose double transistors Rev. 02 — 17 November 2009 1. Product profile 1.1 General description NPN/NPN general-purpose double transistors in a small SOT363 (SC-88) Surface Mounted Device (SMD) plastic package. 1.2 Features Simplifies circuit design Reduces component count ...
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... NXP Semiconductors 3. Ordering information Table 3. Type number PUMX2 4. Marking Table 4. Type number PUMX2 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. ° amb Symbol Per transistor I CBO I EBO CEsat PUMX2_2 Product data sheet NPN/NPN general-purpose double transistors ...
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... NXP Semiconductors 8. Package outline Fig 1. Package outline SOT363 (SC-88) 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PUMX2 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 10. Soldering 2.35 Fig 2. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 3. Wave soldering footprint SOT363 (SC-88) PUMX2_2 Product data sheet NPN/NPN general-purpose double transistors 2.65 1.5 0.6 0.5 (4×) (4×) 0.5 0.6 (4×) (2×) 0.6 (4×) 1.8 1.5 1.5 1.3 1 ...
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... Document ID Release date PUMX2_2 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 1 “Package outline SOT363 • Figure 2 “Reflow soldering footprint SOT363 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Packing information . . . . . . . . . . . . . . . . . . . . . 4 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Legal information ...