IT1-168S-SV Hirose, IT1-168S-SV Datasheet - Page 17

• Manufacturer Part Number: IT1-168S-SV
• Description: Conn Board to Board RCP 168 POS 0.5mm Solder ST SMD Tray
• Manufacturer: Hirose
• Type: Board to Boardr

Specifications of IT1-168S-SV

• Pitch: 0.5 mm
• Number Of Rows: 2
• Number Of Contacts: 168
• Gender: RCP
• Contact Plating: Gold
• Termination Method: Solder

A310
IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System
7. Precautions When Mounting Multiple Connectors
7-1 Allowable Amount of Misalignment
7-2 Recommended Connector Placement
7-3 Examples of Prohibited Placement Positions
Note: Observe the requirements as listed in paragraph 7-1 and 7-2.
The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for
mating / un-mating of multiple connector assemblies in a single operation.
Maximum allowable misalignment in X and Y directions is 0.2 mm total.
Refer to the drawings below.
It is recommended to leave min. of 30 mm space between the adjacent connector assemblies.
To assure reliability of solder joints and mating/ un-mating without damage,
DO NOT PLACE MULTIPLE CONNECTORS as illustrated below.
Length Orientation
X1-X2= + - 0.2
Width Orientation
Y1-Y2= + - 0.2