IT1-168S-SV Hirose, IT1-168S-SV Datasheet - Page 12

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IT1-168S-SV

Manufacturer Part Number
IT1-168S-SV
Description
Conn Board to Board RCP 168 POS 0.5mm Solder ST SMD Tray
Manufacturer
Hirose
Type
Board to Boardr
Datasheet

Specifications of IT1-168S-SV

Pitch
0.5 mm
Number Of Rows
2
Number Of Contacts
168
Gender
RCP
Contact Plating
Gold
Termination Method
Solder

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3-3 Receptacle Board Placement
3-4 Recommended Reflow Conditions
¡When using automatic placement equipment, verify the packaging type and the Pick-and-place areas.
¡When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4.
* When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment.
SPrecautions for Manual PlacementS
The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board.
The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1.
Fig. 4-1 =
Correct
IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System
Fig. 4-2 =
Incorrect
Fig. 4-3 =
Incorrect
A305

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