MCR22-8RL1G ON Semiconductor, MCR22-8RL1G Datasheet - Page 5

• Manufacturer Part Number: MCR22-8RL1G
• Description: THYRISTOR SCR 1.5A 600V TO92
• Manufacturer: ON Semiconductor
• Type: SCRr

Specifications of MCR22-8RL1G

• Scr Type: Sensitive Gate
• Voltage - Off State: 600V
• Voltage - Gate Trigger (vgt) (max): 800mV
• Voltage - On State (vtm) (max): 1.7V
• Current - On State (it (rms)) (max): 1.5A
• Current - Gate Trigger (igt) (max): 200µA
• Current - Hold (ih) (max): 5mA
• Current - Off State (max): 10µA
• Current - Non Rep. Surge 50, 60hz (itsm): 15A @ 60Hz
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Through Hole
• Package / Case: TO-92-3 (Standard Body), TO-226
• Current - On State (it (rms) (max): 1.5A
• Repetitive Peak Off-state Volt: 600V
• Off-state Voltage: 600V
• Hold Current: 5mA
• Gate Trigger Current (max): 200uA
• Gate Trigger Voltage (max): 800mV
• Peak Reverse Gate Voltage: 5V
• Package Type: TO-92
• Peak Repeat Off Current: 10uA
• Peak Surge On-state Current (max): 15A
• On State Voltage(max): 1.7@1AV
• Mounting: Through Hole
• Pin Count: 3
• Operating Temp Range: -40C to 110C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - On State (it (av)) (max): -
• Lead Free Status / Rohs Status: Compliant
• Other names: MCR22-8RL1GOS; MCR22-8RL1GOS; MCR22-8RL1GOSTR

NOTES:
Tape Feedhole Diameter
Component Lead Thickness Dimension
Component Lead Pitch
Bottom of Component to Seating Plane
Feedhole Location
Deflection Left or Right
Deflection Front or Rear
Feedhole to Bottom of Component
Feedhole to Seating Plane
Defective Unit Clipped Dimension
Lead Wire Enclosure
Feedhole Pitch
Feedhole Center to Center Lead
First Lead Spacing Dimension
Adhesive Tape Thickness
Overall Taped Package Thickness
Carrier Strip Thickness
Carrier Strip Width
Adhesive Tape Width
Adhesive Tape Position
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
H4 H5
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
Item
H
H2A
P2
P1
Figure 9. Device Positioning on Tape
F1
P
F2
H2A
P2
http://onsemi.com
Symbol
F1, F2
H2A
H2B
W1
W2
D2
H1
H4
H5
P1
P2
T1
T2
L1
W
D
H
L
P
T
5
L
D
W2
L1
0.09842
0.1496
0.0945
0.3346
0.7086
0.3346
0.4921
0.2342
0.1397
0.6889
0.2165
0.015
0.610
0.014
.0059
Min
.059
0.06
H1
0
0
−
W1
W
Inches
0.01968
0.1653
0.3741
0.5079
0.2658
0.1556
0.0567
0.7481
0.2841
0.020
0.039
0.051
0.768
0.649
0.433
0.027
0.110
Max
.156
0.08
−
Specification
T1
T
H2B
H2B
Min
0.38
15.5
12.5
5.95
3.55
0.15
0.35
17.5
T2
3.8
2.4
1.5
8.5
8.5
2.5
5.5
.15
18
0
0
−
Millimeter
Max
0.51
19.5
16.5
12.9
6.75
3.95
0.20
1.44
0.65
4.2
2.8
4.0
9.5
1.0
1.0
6.3
0.5
19
11
−