MRF7S19170HSR3 Freescale Semiconductor, MRF7S19170HSR3 Datasheet

IC MOSFET RF N-CHAN NI-880S

MRF7S19170HSR3

Manufacturer Part Number
MRF7S19170HSR3
Description
IC MOSFET RF N-CHAN NI-880S
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MRF7S19170HSR3

Transistor Type
N-Channel
Frequency
1.93GHz
Gain
17.2dB
Voltage - Rated
65V
Current Rating
10µA
Current - Test
1.4A
Voltage - Test
28V
Power - Output
50W
Package / Case
NI-880S
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
50W
Power Gain (typ)@vds
17.2dB
Frequency (min)
1.93GHz
Frequency (max)
1.99GHz
Package Type
NI-880S
Pin Count
3
Output Capacitance (typ)@vds
703@28VpF
Reverse Capacitance (typ)
0.9@28VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
32%
Mounting
Surface Mount
Mode Of Operation
1-Carrier W-CDMA
Number Of Elements
1
Vswr (max)
5
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant
© Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N - Channel Enhancement - Mode Lateral MOSFETs
1990 MHz. Can be used in Class AB and Class C for all typical cellular base
station modulations.
• Typical Single - Carrier W - CDMA Performance: V
• Capable of Handling 5:1 VSWR, @ 32 Vdc, 1960 MHz, 170 Watts CW
• P
Features
• 100% PAR Tested for Guaranteed Output Power Capability
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Internally Matched for Ease of Use
• Integrated ESD Protection
• Greater Negative Gate - Source Voltage Range for Improved Class C
• Designed for Digital Predistortion Error Correction Systems
• RoHS Compliant
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Freescale Semiconductor
Technical Data
Table 1. Maximum Ratings
Table 2. Thermal Characteristics
Drain - Source Voltage
Gate - Source Voltage
Operating Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
Thermal Resistance, Junction to Case
Designed for CDMA base station applications with frequencies from 1930 to
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
1400 mA, P
64 DPCH with 50% Clipping, Channel Bandwidth = 3.84 MHz, Input Signal
PAR = 7.5 dB @ 0.01% Probability on CCDF.
Output Power
Operation
Case Temperature 80°C, 170 W CW
Case Temperature 72°C, 25 W CW
out
Power Gain — 17.2 dB
Drain Efficiency — 32%
Device Output Signal PAR — 6.2 dB @ 0.01% Probability on CCDF
ACPR @ 5 MHz Offset — - 37.5 dBc in 3.84 MHz Channel Bandwidth
MTTF calculators by product.
Select Documentation/Application Notes - AN1955.
@ 1 dB Compression Point w 170 Watts CW
out
= 50 Watts Avg., Full Frequency Band, 3GPP Test Model 1,
(1,2)
Characteristic
Rating
DD
= 28 Volts, I
DQ
=
Symbol
Symbol
V
R
V
V
T
T
DSS
T
θJC
GS
DD
stg
C
J
Document Number: MRF7S19170H
CASE 465B - 03, STYLE 1
CASE 465C - 02, STYLE 1
MRF7S19170HR3 MRF7S19170HSR3
1930 - 1990 MHz, 50 W AVG., 28 V
MRF7S19170HSR3
MRF7S19170HR3
MRF7S19170HSR3
MRF7S19170HR3
LATERAL N - CHANNEL
RF POWER MOSFETs
NI - 880S
NI - 880
SINGLE W - CDMA
- 65 to +150
Value
- 0.5, +65
- 6.0, +10
32, +0
Value
0.25
0.31
150
225
(2,3)
Rev. 1, 12/2008
°C/W
Unit
Unit
Vdc
Vdc
Vdc
°C
°C
°C
1

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MRF7S19170HSR3 Summary of contents

Page 1

... MHz AVG CASE 465B - 03, STYLE 1 MRF7S19170HR3 CASE 465C - 02, STYLE 1 MRF7S19170HSR3 Symbol V DSS stg Symbol R θJC MRF7S19170HR3 MRF7S19170HSR3 Rev. 1, 12/2008 SINGLE W - CDMA LATERAL N - CHANNEL RF POWER MOSFETs NI - 880 NI - 880S Value Unit - 0.5, +65 Vdc - 6.0, +10 Vdc 32, +0 Vdc - 65 to +150 °C 150 °C 225 °C ...

Page 2

... Output Peak - to - Average Ratio @ 0.01% Probability on CCDF Adjacent Channel Power Ratio Input Return Loss Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit GG GS(Q) schematic. 2. Part internally matched both on input and output. MRF7S19170HR3 MRF7S19170HSR3 2 = 25°C unless otherwise noted) C Symbol I DSS I DSS I ...

Page 3

... Min Typ Max = 1400 mA, 1930 - 1990 MHz Bandwidth — 25 — — 0.5 — — 2.06 — — 4.7 — — 16 — — 0.015 — — 0.01 — MRF7S19170HR3 MRF7S19170HSR3 Unit MHz dB ° ns ° dB/°C dBm/°C 3 ...

Page 4

... Chip Capacitor C12 1.5 pF Chip Capacitor C13 0.3 pF Chip Capacitor C14 0.8 pF Chip Capacitor C19 470 μ Electrolytic Capacitor, Axial R1 kΩ, 1/4 W Chip Resistors R3 10 Ω, 1/4 W Chip Resistor MRF7S19170HR3 MRF7S19170HSR3 4 Z20 Z7 C8 C15 Z10 Z11 Z12 Z13 DUT C14 ...

Page 5

... Figure 2. MRF7S19170HR3(HSR3) Test Circuit Component Layout RF Device Data Freescale Semiconductor C19 C8 C15 C16 C10 C11 C14 C13 C12 C17 C18 C9 MRF7S19170H Rev 0 MRF7S19170HR3 MRF7S19170HSR3 5 ...

Page 6

... DQ 1750 mA 17 1400 mA 1050 mA 16 700 OUTPUT POWER (WATTS) PEP out Figure 5. Two - Tone Power Gain versus Output Power MRF7S19170HR3 MRF7S19170HSR3 6 TYPICAL CHARACTERISTICS Vdc (Avg.), I DD out DQ Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth, PAR = 7 0.01% Probability (CCDF) 1900 1920 1940 ...

Page 7

... DQ IM3−U IM3−L IM5−U IM5−L 10 TWO−TONE SPACING (MHz) versus Tone Spacing 50 Ideal Actual −30_C T = −30_C C 25_C 25_C 85_C 85_C Vdc 1400 1960 MHz 10 100 P , OUTPUT POWER (WATTS) CW out versus CW Output Power MRF7S19170HR3 MRF7S19170HSR3 100 400 7 ...

Page 8

... W−CDMA. ACPR Measured in 3.84 MHz Channel Bandwidth @ "5 MHz Offset. 0.001 PAR = 7 0.01% Probability on CCDF 0.0001 PEAK−TO−AVERAGE (dB) Figure 14. CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 50% Clipping, Single - Carrier Test Signal MRF7S19170HR3 MRF7S19170HSR3 8 TYPICAL CHARACTERISTICS 1400 1960 MHz ...

Page 9

... Z = Test circuit impedance as measured from source gate to ground Test circuit impedance as measured load from drain to ground. Device Input Under Matching Test Network Z Z source load Output Matching Network MRF7S19170HR3 MRF7S19170HSR3 9 ...

Page 10

... P , INPUT POWER (dBm) in NOTE: Measured in a Peak Tuned Load Pull Fixture Test Impedances per Compression Level Z source Ω P3dB 2.34 - j9.24 Figure 17. Pulsed CW Output Power versus Input Power MRF7S19170HR3 MRF7S19170HSR3 10 62 Ideal P3dB = 54.9 dBm (310 P1dB = 54.14 dBm 56 Actual (259 W) ...

Page 11

... N 0.871 0.889 19.30 22.60 R 0.515 0.525 13.10 13.30 S 0.515 0.525 13.10 13.30 aaa 0.007 REF 0.178 REF F bbb 0.010 REF 0.254 REF ccc 0.015 REF 0.381 REF STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE MRF7S19170HR3 MRF7S19170HSR3 5.08 1.14 0.15 1.70 5.33 11 ...

Page 12

... Replaced Fig. 13, MTTF versus Junction Temperature with updated graph. Removed Amps operating characteristics and location of MTTF calculator for device • Deleted output signal data from Fig. 14, CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 50% Clipping, Single - Carrier Test Signal MRF7S19170HR3 MRF7S19170HSR3 12 PRODUCT DOCUMENTATION REVISION HISTORY ...

Page 13

... Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006, 2008. All rights reserved. MRF7S19170HR3 MRF7S19170HSR3 13 ...

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