HSMP-389F-TR1 Avago Technologies US Inc., HSMP-389F-TR1 Datasheet - Page 8

• Manufacturer Part Number: HSMP-389F-TR1
• Description: DIODE PIN SWITCH 100V 1A SOT-323
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-389F-TR1

• Package / Case: SC-70-3, SOT-323-3
• Diode Type: PIN - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 5mA, 100MHz
• Series Resistance @ If: 2.5ohm
• Peak Reflow Compatible (260 C): No
• Reel Quantity: 3000
• Pin Configuration: Common Cathode
• Leaded Process Compatible: No
• Mounting Type: Surface Mount
• Breakdown Voltage: 100V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant

Assembly Information
Figure 22. Recommended PCB Pad Layout for
Agilent’s SC70 6L / SOT-363 Products.
Figure 23. Recommended PCB Pad Layout for
Agilent’s SC70 3L / SOT-323 Products.
Figure 24. Recommended PCB Pad Layout for
Agilent’s SOT-23 Products.
Figure 25. Recommended PCB Pad Layout for
Agilent’s SOT-143 Products.
8
DIMENSIONS IN
0.061
2.05
0.039
0.039
DIMENSIONS IN
0.039
0.035
1
0.9
0.047
1.2
0.026
0.026
0.112
0.079
2.85
0.071
0.031
1.8
2
0.8
inches
mm
inches
mm
0.033
0.018
0.022
0.85
0.048
1.2
0.031
0.033
0.079
0.033
0.85
0.85
0.8
0.079
0.114
2.9
0.039
0.079
2.0
1
SMT Assembly
Reliable assembly of surface
mount components is a
complex process that involves
many material, process, and
equipment factors, including:
method of heating (e.g., IR or
vapor phase reflow, wave
soldering, etc.) circuit board
material, conductor thickness
and pattern, type of solder
alloy, and the thermal
conductivity and thermal mass
of components. Components
with a low mass, such as the
SOT package, will reach solder
reflow temperatures faster than
those with a greater mass.
Agilent’s diodes have been
qualified to the time-
temperature profile shown in
Figure 26. This profile is
representative of an IR reflow
type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder
paste) passes through one or
Figure 26. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
more preheat zones. The
preheat zones increase the
temperature of the board and
components to prevent thermal
shock and begin evaporating
solvents from the solder paste.
The reflow zone briefly
elevates the temperature
sufficiently to produce a reflow
of the solder.
The rates of change of
temperature for the ramp-up
and cool-down zones are
chosen to be low enough to
not cause deformation of the
board or damage to
components due to thermal
shock. The maximum
temperature in the reflow zone
(T
235°C.
These parameters are typical
for a surface mount assembly
process for Agilent diodes. As
a general guideline, the circuit
board and components should
be exposed only to the
minimum temperatures and
times necessary to achieve a
uniform reflow of solder.
Reflow
MAX
Zone
) should not exceed
180
Cool Down
Zone
240
T
MAX
300