NTMD4184PFR2G ON Semiconductor, NTMD4184PFR2G Datasheet

no-image

NTMD4184PFR2G

Manufacturer Part Number
NTMD4184PFR2G
Description
MOSFET P-CH 30V 2.3A 8-SOIC
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTMD4184PFR2G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Diode (Isolated)
Rds On (max) @ Id, Vgs
95 mOhm @ 3A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
2.3A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
4.2nC @ 4.5V
Input Capacitance (ciss) @ Vds
360pF @ 10V
Power - Max
770mW
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Configuration
Single Dual Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.095 Ohms
Drain-source Breakdown Voltage
- 30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
4 A
Power Dissipation
2.31 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTMD4184PFR2G
Manufacturer:
ON Semiconductor
Quantity:
1 600
Part Number:
NTMD4184PFR2G
Manufacturer:
ON/安森美
Quantity:
20 000
NTMD4184PF
Power MOSFET and
Schottky Diode
-30 V, -4.0 A, Single P-Channel with 20 V,
2.2 A, Schottky Barrier Diode
Features
Applications
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
MOSFET MAXIMUM RATINGS
SCHOTTKY MAXIMUM RATINGS
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current R
Power Dissipation
R
Continuous Drain
Current R
Power Dissipation
R
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Peak Repetitive Reverse Voltage
DC Blocking Voltage
Average Rectified Forward
Current, (Note 1)
Design Flexibility
Conduction Losses
FETKYt Surface Mount Package Saves Board Space
Independent Pin-Out for MOSFET and Schottky Allowing for
Low R
Optimized Gate Charge to Minimize Switching Losses
This is a Pb-Free Device
Disk Drives
DC-DC Converters
Printers
qJA
qJA
qJA
(Note 1)
(Note 2)
t < 10 s (Note 1)
DS(on)
qJA
qJA
qJA
(Note 1)
(Note 2)
t < 10 s
MOSFET and Low V
Rating
Steady
State
T
t
A
p
= 10 ms
= 25°C,
T
T
T
T
T
T
T
T
T
(T
A
A
A
A
A
A
A
A
A
t < 10 s
Steady
State
J
= 25°C
= 25°C
= 25°C
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
(T
= 25°C unless otherwise stated)
F
J
Schottky to Minimize
= 25°C unless otherwise stated)
T
Symbol
J
V
V
V
, T
I
P
P
P
V
RRM
DSS
DM
T
I
I
I
I
I
GS
D
D
D
S
F
D
D
D
R
L
STG
-55 to
Value
+150
-3.3
-2.6
-2.3
-1.8
0.77
-4.0
-3.2
2.31
-1.3
-30
±20
-10
260
1.6
2.2
3.2
20
20
1
Unit
°C
°C
W
W
W
V
V
A
A
A
A
A
V
V
A
†For information on tape and reel specifications,
NTMD4184PFR2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
G
V
V
8
P-Channel MOSFET
(BR)DSS
-30 V
R
20 V
Device
Max
1
ORDERING INFORMATION
4184PF = Device Code
A
Y
WW
G
P-CHANNEL MOSFET
S
SCHOTTKY DIODE
http://onsemi.com
165 mW @ -4.5 V
CASE 751
95 mW @ -10 V
STYLE 18
D
SOIC-8
R
= Assembly Location
= Year
= Work Week
= Pb-Free Package
DS(on)
(Pb-Free)
Package
V
SOIC-8
0.58 V
F
Publication Order Number:
Max
MARKING DIAGRAM
& PIN ASSIGNMENT
Max
Schottky Diode
8
1
2500/Tape & Reel
C C D D
A A S G
NTMD4184PF/D
4184PF
AYWW
Shipping
A
C
G
I
-4.0 A
D
I
2.2 A
F
Max
Max

Related parts for NTMD4184PFR2G

NTMD4184PFR2G Summary of contents

Page 1

... Year WW = Work Week G = Pb-Free Package ORDERING INFORMATION Device Package Shipping NTMD4184PFR2G SOIC-8 2500/Tape & Reel (Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: ...

Page 2

THERMAL RESISTANCE MAXIMUM RATINGS Parameter MOSFET & Schottky Junction-to-Ambient – Steady State (Note 1) Junction-to-Ambient – t ≤10 s Steady State (Note 1) Junction-to-FOOT (Drain) Equivalent to R Junction-to-Ambient – Steady State (Note 2) 1. Surface-mounted on FR4 board using ...

Page 3

ELECTRICAL CHARACTERISTICS Characteristic SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS Parameter Maximum Instantaneous Forward Voltage Maximum Instantaneous Reverse Current 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. 10 5.0 V ...

Page 4

1.4 GS 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 - JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature 400 350 ...

Page 5

Single Pulse 0.01 0.0000001 0.000001 0.00001 0.0001 Figure 11. Thermal Response - R 100 0.5 0.2 0.1 10 0.05 0.02 1 0.01 0.1 Single Pulse 0.01 0.001 0.0000001 0.000001 ...

Page 6

T = 125° 85°C J 100E-6 10E 25°C J 1E-6 100E REVERSE VOLTAGE (V) R Figure 15. Typical Reverse Current 1000 100 10 0 NTMD4184PF TYPICAL CHARACTERISTICS 100E-3 ...

Page 7

... *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. FETKY and Micro8 are registered trademarks of International Rectifier Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

Related keywords