NTB25P06 ON Semiconductor, NTB25P06 Datasheet

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NTB25P06

Manufacturer Part Number
NTB25P06
Description
MOSFET P-CH 60V 27.5A D2PAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTB25P06

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
82 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
27.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
1680pF @ 25V
Power - Max
120W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTB25P06
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
NTB25P06G
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
NTB25P06G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTB25P06T4
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
NTB25P06T4G
Manufacturer:
FREESCALE
Quantity:
760
Company:
Part Number:
NTB25P06T4G
Quantity:
620
NTB25P06
Power MOSFET
−60 V, −27.5 A, P−Channel D
withstand high energy in the avalanche and commutation modes.
Features
Typical Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size
2. When surface mounted to an FR4 board using the minimum recommended
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 3
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Operating and Storage
Single Pulse Drain−to−Source Avalanche
Thermal Resistance
Designed for low voltage, high speed switching applications and to
Pb−Free Packages are Available
PWM Motor Controls
Power Supplies
Converters
Bridge Circuits
(Cu Area 1.127 in
pad size (Cu Area 0.412 in
Temperature Range
Energy − Starting T
(V
I
L(pk)
DD
− Continuous
− Non−Repetitive (t
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
− Continuous @ T
− Single Pulse (t
= 25 V, V
= 20 A, L = 3 mH, R
GS
Rating
2
).
= 10 V,
J
p
(T
= 25°C
v10 ms)
A
p
J
v10 ms)
= 25°C
= 25°C unless otherwise noted)
G
2
A
).
= 25 W)
= 25°C
Symbol
T
V
V
R
R
R
J
2
V
E
I
GSM
P
DSS
, T
T
DM
I
qJC
qJA
qJA
GS
AS
D
PAK
D
L
stg
−55 to
Value
+175
"15
"20
27.5
1.25
46.8
63.2
−60
120
600
260
80
1
°C/W
Unit
Vpk
Apk
mJ
°C
°C
W
V
V
A
†For information on tape and reel specifications,
NTB25P06
NTB25P06G
NTB25P06T4
NTB25P06T4G
1
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
CASE 418B
(BR)DSS
−60 V
Device
3
2
D
2
PAK
NTB25P06 = Device Code
G
A
Y
WW
ORDERING INFORMATION
G
http://onsemi.com
4
65 mW @ −10 V
R
(Pb−Free)
(Pb−Free)
Package
DS(on)
D
D
D
D
P−Channel
2
2
2
2
= Pb−Free Device
= Assembly Location
= Year
= Work Week
PAK
PAK
PAK
PAK
D
Publication Order Number:
MARKING DIAGRAM
& PIN ASSIGNMENT
TYP
S
Gate
800/Tape & Reel
800/Tape & Reel
25P06G
Drain
Drain
50 Units/Rail
50 Units/Rail
AYWW
Shipping
NTB25P06/D
NTB
I
−27.5 A
D
Source
MAX

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NTB25P06 Summary of contents

Page 1

... MAX DS(on) D −27 −10 V P−Channel MARKING DIAGRAM & PIN ASSIGNMENT Drain 4 NTB 25P06G AYWW 2 PAK Drain Gate Source NTB25P06 = Device Code G = Pb−Free Device A = Assembly Location Y = Year WW = Work Week ORDERING INFORMATION † Package Shipping 2 D PAK 50 Units/Rail 2 D PAK 50 Units/Rail (Pb− ...

Page 2

... BODY−DRAIN DIODE RATINGS (Note 3) Diode Forward On−Voltage (I = − Reverse Recovery Time Reverse Recovery Stored Charge 3. Indicates Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperatures. NTB25P06 (T = 25°C unless otherwise noted) C Symbol V (BR)DSS I DSS ...

Page 3

... Figure 3. On−Resistance vs. Drain Current and Temperature 1. − − 1.5 1.25 1 0.75 0.5 −50 − JUNCTION TEMPERATURE (°C) J Figure 5. On−Resistance Variation with Temperature NTB25P06 25°C ≥ − −6 V −5 − −4.5 V −4 −V , GATE−TO−SOURCE VOLTAGE (VOLTS) GS Figure 2. Transfer Characteristics ...

Page 4

... V = − SINGLE PULSE T = 25°C C 100 Limit DS(on) Thermal Limit Package Limit 0.1 0.1 1 −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTB25P06 25° iss 4 C oss 2 rss Drain−to−Source Voltage vs. Total Charge 25 V ...

Page 5

... PL 0.13 (0.005) M VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 10.66 0.42 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTB25P06 PACKAGE DIMENSIONS 2 D PAK CASE 418B−04 ISSUE ...

Page 6

... USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NTB25P06/D ...

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