BUK9635-55,118 NXP Semiconductors, BUK9635-55,118 Datasheet

MOSFET N-CH 55V 34A SOT404

BUK9635-55,118

Manufacturer Part Number
BUK9635-55,118
Description
MOSFET N-CH 55V 34A SOT404
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet
1.BUK9635-55118.pdf (8 pages)

Specifications of BUK9635-55,118

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
35 mOhm @ 17A, 5V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
34A
Vgs(th) (max) @ Id
2V @ 1mA
Input Capacitance (ciss) @ Vds
1400pF @ 25V
Power - Max
85W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Other names
934050500118
BUK9635-55 /T3
BUK9635-55 /T3
Philips Semiconductors
GENERAL DESCRIPTION
N-channel enhancement mode logic
level field-effect power transistor in a
plastic envelope suitable for surface
mounting. Using ’trench’ technology
the device features very low on-state
resistance and has integral zener
diodes giving ESD protection up to
2kV. It is intended for use in
automotive and general purpose
switching applications.
PINNING - SOT404
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
ESD LIMITING VALUE
THERMAL RESISTANCES
April 1998
TrenchMOS
Logic level FET
SYMBOL
V
V
I
I
I
P
T
SYMBOL
V
SYMBOL
R
R
D
D
DM
PIN
V
stg
DS
DGR
tot
C
mb
th j-mb
th j-a
1
2
3
GS
, T
j
gate
drain
source
drain
DESCRIPTION
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
PARAMETER
Electrostatic discharge capacitor
voltage, all pins
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
transistor
QUICK REFERENCE DATA
PIN CONFIGURATION
SYMBOL
V
I
P
T
R
D
j
DS
tot
DS(ON)
1
2
CONDITIONS
-
R
-
T
T
T
T
-
CONDITIONS
Human body model
(100 pF, 1.5 k )
CONDITIONS
-
Minimum footprint, FR4
board
mb
mb
mb
mb
GS
3
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
= 25 ˚C
= 100 ˚C
= 25 ˚C
= 25 ˚C
= 20 k
1
mb
V
GS
= 5 V
SYMBOL
TYP.
MIN.
MIN.
- 55
50
-
-
-
-
-
-
-
-
-
g
MAX.
Product specification
175
55
34
85
35
MAX.
MAX.
MAX.
1.75
136
175
55
55
10
34
24
85
2
BUK9635-55
-
d
s
Rev 1.100
UNIT
UNIT
UNIT
K/W
K/W
UNIT
kV
W
˚C
m
V
V
V
A
A
A
W
˚C
V
A

Related parts for BUK9635-55,118

Image
Part Number
Description
Manufacturer
Datasheet
Request R
BUK9635-55A
Part Number:
BUK9635-55A
Description:
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
BUK9635-55A.pdf (9 pages)
BUK9635-100A
Part Number:
BUK9635-100A
Description:
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
BUK9635-100A.pdf (13 pages)
BUK9635-55A,118
Part Number:
BUK9635-55A,118
Description:
MOSFET N-CH 55V 34A SOT404
Manufacturer:
NXP Semiconductors
Datasheet:
BUK9535-55A127.pdf (9 pages)
BUK9635-100A,118
Part Number:
BUK9635-100A,118
Description:
MOSFET N-CH 100V 41A SOT404
Manufacturer:
NXP Semiconductors
Datasheet:
BUK9535-100A127.pdf (15 pages)
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

BUK9635-55,118 Summary of contents

Page 1

... R Drain-source on-state DS(ON) resistance V PIN CONFIGURATION CONDITIONS - ˚ 100 ˚ ˚ ˚ CONDITIONS Human body model (100 pF, 1 CONDITIONS - Minimum footprint, FR4 board 1 Product specification BUK9635-55 MAX 175 SYMBOL MIN. MAX. UNIT - 136 - 175 MIN. MAX. UNIT - 2 TYP. MAX. UNIT - 1 ...

Page 2

... 175˚C j CONDITIONS MHz Resistive load Measured from upper edge of drain tab to centre of die Measured from source lead soldering point to source bond pad CONDITIONS -dI /dt = 100 - Product specification BUK9635-55 MIN. TYP. MAX. UNIT 1 0 2 500 MIN. TYP. MAX. UNIT ...

Page 3

... CONDITIONS 1000 ID/A 100 10 120 140 160 180 f & 0.1 0.01 120 140 160 180 Product specification BUK9635-55 MIN. TYP. MAX ˚C mb RDS(ON) = VDS/ VDS/V Fig.3. Safe operating area ˚ f single pulse; parameter ZTH/ (K/W) 1 0.5 0.2 0 0.05 0. 1.0E-06 0.0001 0.01 ...

Page 4

... GS 2.5 4.2 2 4.4 4.6 1.5 4 0.5 -100 ˚C . Fig.9. Normalised drain-source on-state resistance VGS(TO 2.5 2 1.5 1 0.5 0 -100 GS(TO) 4 Product specification BUK9635- ID f(I ); conditions BUK959-60 Rds(on) normlised to 25degC a - 100 150 Tmb / degC / DS(ON) DS(ON)25 ˚ BUK959-60 max. typ. min. -50 ...

Page 5

... 120 110 100 Ciss Coss Crss 10 100 , Fig.15. Normalised avalanche energy rating. iss oss rss VDS = 44V VGS Product specification BUK9635-55 Tj/C = 175 0 0.5 1 VSDS/V Fig.14. Typical reverse diode current. = f(V ); conditions parameter T SDS GS WDSS 100 120 140 Tmb / f(T ) ...

Page 6

... Philips Semiconductors TrenchMOS transistor Logic level FET RD VGS RG 0 Fig.17. Switching test circuit. April 1998 VDD + VDS - T.U.T. 6 Product specification BUK9635-55 Rev 1.100 ...

Page 7

... Epoxy meets UL94 V0 at 1/8". April 1998 10.3 max 11 max 15.4 0.85 max (x2) Fig.18. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.19. SOT404 : soldering pattern for surface mounting . 7 Product specification BUK9635-55 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.100 ...

Page 8

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1998 8 Product specification BUK9635-55 Rev 1.100 ...

Related keywords