SIB411DK-T1-E3 Vishay, SIB411DK-T1-E3 Datasheet - Page 2

• Manufacturer Part Number: SIB411DK-T1-E3
• Description: MOSFET P-CH 20V 9A SC75-6
• Manufacturer: Vishay
• Series: TrenchFET®r

Specifications of SIB411DK-T1-E3

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 66 mOhm @ 3.3A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 9A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 15nC @ 8V
• Input Capacitance (ciss) @ Vds: 470pF @ 10V
• Power - Max: 13W
• Mounting Type: Surface Mount
• Package / Case: PowerPAK® SC-75-6L
• Configuration: Single Quad Drain
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.066 Ohms
• Drain-source Breakdown Voltage: - 20 V
• Gate-source Breakdown Voltage: +/- 8 V
• Continuous Drain Current: 4.8 A
• Power Dissipation: 2.4 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SIB411DK-T1-E3TR

SiB411DK
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
SPECIFICATIONS T
Parameter
Static
Drain-Source Breakdown Voltage
V
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
DS
GS(th)
Temperature Coefficient
Temperature Coefficient
b
a
a
J
= 25 °C, unless otherwise noted
a
ΔV
Symbol
ΔV
R
V
GS(th)
I
t
t
t
t
I
I
C
V
DS(on)
C
V
GS(th)
D(on)
C
Q
Q
d(on)
d(off)
d(on)
d(off)
I
GSS
DSS
Q
DS
g
Q
R
SM
I
t
t
t
DS
oss
t
t
t
t
SD
rss
iss
gd
S
rr
a
b
fs
gs
r
r
f
f
g
rr
g
/T
/T
J
J
I
V
F
V
I
DS
D
= - 3.8 A, di/dt = 100 A/µs, T
V
I
V
DS
D
DS
≅ - 4.8 A, V
DS
≅ - 4.8 A, V
= - 10 V, V
= - 10 V, V
V
= - 20 V, V
V
V
= - 10 V, V
V
V
V
V
V
V
V
GS
V
I
GS
GS
DS
DS
DD
DD
GS
S
DS
DS
DS
= - 3.8 A, V
= - 1.8 V, I
Test Conditions
= - 4.5 V, I
= - 2.5 V, I
= V
= - 10 V, I
= - 10 V, R
= - 10 V, R
= 0 V, I
≤ 5 V, V
= - 20 V, V
= 0 V, V
I
D
T
f = 1 MHz
GS
GEN
GS
= - 250 µA
C
GEN
GS
GS
= 25 °C
GS
, I
= - 4.5 V, I
D
= - 8 V, I
D
= - 4.5 V, R
GS
= 0 V, T
GS
= - 8 V, R
= 0 V, f = 1 MHz
= - 250 µA
D
D
= - 250 µA
D
D
GS
L
L
GS
= - 4.5 V
= - 0.77 A
= - 3.3 A
= - 3.3 A
= - 2.8 A
= ± 8 V
= 2.1 Ω
= 2.1 Ω
= 0 V
= 0 V
D
J
D
= 55 °C
= - 4.5 A
g
J
= - 4.5 A
g
= 1 Ω
= 25 °C
= 1 Ω
Min.
- 0.4
- 20
15
0.055
0.077
0.107
- 0.85
Typ.
- 18
470
2.2
9.5
0.9
1.4
7.5
95
65
10
10
40
45
75
10
25
10
20
10
15
6
5
5
S-80515-Rev. C, 10-Mar-08
Document Number: 74335
± 100
0.130
0.066
0.094
Max.
- 1.2
- 10
115
- 1
- 1
15
15
60
70
10
15
40
15
- 9
15
40
20
9
mV/°C
Unit
µA
nC
nC
nA
pF
ns
ns
ns
V
V
A
Ω
S
Ω
A
V