IRF510S Vishay, IRF510S Datasheet

MOSFET N-CH 100V 5.6A D2PAK

IRF510S

Manufacturer Part Number
IRF510S
Description
MOSFET N-CH 100V 5.6A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF510S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
540 mOhm @ 3.4A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
5.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
8.3nC @ 10V
Input Capacitance (ciss) @ Vds
180pF @ 25V
Power - Max
3.7W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF510S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF510S
Manufacturer:
IR
Quantity:
5 000
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91016
S-82996-Rev. A, 19-Jan-09
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Linear Derating Factor (PCB Mount)
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ 5.6 A, dI/dt ≤ 75 A/µs, V
= 25 V, starting T
G D
(Ω)
D
S
2
PAK (TO-263)
a
a
J
= 25 °C, L = 4.8 mH, R
c
a
DD
b
V
≤ V
GS
D
IRF510SPbF
SiHF510S-E3
IRF510S
SiHF510S
e
= 10 V
DS
2
G
PAK (TO-263)
, T
N-Channel MOSFET
J
e
Single
≤ 175 °C.
100
8.3
2.3
3.8
G
D
S
= 25 Ω, I
C
Power MOSFET
= 25 °C, unless otherwise noted
V
0.54
GS
AS
at 10 V
= 5.6 A (see fig. 12).
T
T
for 10 s
C
A
= 25 °C
= 25 °C
T
T
C
C
D
IRF510STRLPbF
SiHF510STL-E3
IRF510STRL
SiHF510STL
= 100 °C
= 25 °C
2
FEATURES
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• 175 °C Operating Temperature
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The D
capable of accommodating die sizes up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
PAK (TO-263)
2
PAK (TO-263) is suitable for high current applications
2
PAK (TO-263) is a surface mount power package
a
a
SYMBOL
T
dV/dt
a
J
V
V
E
E
I
a
I
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
stg
IRF510S, SiHF510S
design,
- 55 to + 175
D
IRF510STRRPbF
SiHF510STR-E3
IRF510STRR
SiHF510STR
2
LIMIT
0.025
300
PAK (TO-263)
± 20
0.29
100
100
5.6
4.0
5.6
4.3
3.7
5.5
20
43
low
Vishay Siliconix
d
on-resistance
a
a
a
www.vishay.com
a
UNIT
W/°C
V/ns
mJ
mJ
°C
W
V
A
A
and
1

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IRF510S Summary of contents

Page 1

... IRF510STRL SiHF510STL = 25 °C, unless otherwise noted ° 100 ° ° °C A for Ω 5.6 A (see fig. 12 ≤ 175 °C. J IRF510S, SiHF510S Vishay Siliconix device design, low on-resistance 2 D PAK (TO-263 IRF510STRRPbF a a SiHF510STR- IRF510STRR a a SiHF510STR SYMBOL LIMIT V 100 DS V ± ...

Page 2

... IRF510S, SiHF510S Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient a (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... Fig Typical Output Characteristics, T Document Number: 91016 S-82996-Rev. A, 19-Jan- 4 ° 91016_03 = 25 °C C 3.0 2.5 2.0 1.5 4.5 V 1.0 0.5 = 175 °C 0 91016_04 = 175 °C Fig Normalized On-Resistance vs. Temperature C IRF510S, SiHF510S Vishay Siliconix 1 ° ° 175 µs Pulse Width - Gate-to-Source Voltage ( Fig Typical Transfer Characteristics ...

Page 4

... IRF510S, SiHF510S Vishay Siliconix 400 MHz iss rss gd 320 oss ds 240 C iss 160 C oss 80 C rss Drain-to-Source Voltage ( 91016_05 Fig Typical Capacitance vs. Drain-to-Source Voltage 5 Total Gate Charge (nC) 91016_06 G Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com Shorted 91016_07 Fig Typical Source-Drain Diode Forward Voltage ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91016 S-82996-Rev. A, 19-Jan-09 150 175 Single Pulse (Thermal Response Rectangular Pulse Duration (s) 1 IRF510S, SiHF510S Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit ...

Page 6

... IRF510S, SiHF510S Vishay Siliconix Vary t to obtain p required I AS D.U 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit 91016_12c Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com Fig. 12b - Unclamped Inductive Waveforms 300 Top ...

Page 7

... SD • D.U.T. - device under test P.W. Period D = Period P.W. waveform SD Body diode forward current dI/dt waveform DS Diode recovery dV/dt Body diode forward drop Ripple ≤ for logic level devices Fig For N-Channel IRF510S, SiHF510S Vishay Siliconix + + www.vishay.com 7 ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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