NTR4170NT1G ON Semiconductor, NTR4170NT1G Datasheet

MOSFET N-CH 30V 3.2A SOT23

NTR4170NT1G

Manufacturer Part Number
NTR4170NT1G
Description
MOSFET N-CH 30V 3.2A SOT23
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of NTR4170NT1G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
55 mOhm @ 3.2A, 10V
Drain To Source Voltage (vdss)
30V
Vgs(th) (max) @ Id
1.4V @ 250µA
Gate Charge (qg) @ Vgs
4.76nC @ 4.5V
Input Capacitance (ciss) @ Vds
432pF @ 15V
Power - Max
780mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.055 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
8 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
4 A
Power Dissipation
780 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.055Ohm
Drain-source On-volt
30V
Gate-source Voltage (max)
±12V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Continuous Drain (id) @ 25° C
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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NTR4170N
Power MOSFET
30 V, 3.2 A, Single N−Channel, SOT−23
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2008
June, 2008 − Rev. 0
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t ≤ 30 s
Junction−to−Ambient − t < 10 s (Note 1)
Low R
Low Gate Charge
Low Threshold Voltage
Halide Free
This is a Pb−Free Device
Power Converters for Portables
Battery Management
Load/Power Switch
[2 oz] including traces).
DS(on)
Parameter
Parameter
(T
J
t ≤ 30 s
t ≤ 10 s
Steady
State
t ≤ 10 s
= 25°C unless otherwise noted)
t
p
= 10 ms
T
T
T
T
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
Symbol
Symbol
V
V
T
R
R
R
I
P
T
DSS
T
I
DM
I
stg
GS
D
S
qJA
qJA
qJA
J
D
L
,
−55 to
Value
0.78
1.25
0.78
Max
±12
150
260
260
153
100
3.2
2.3
4.0
8.0
30
1
°C/W
Unit
Unit
°C
°C
W
V
V
A
A
A
†For information on tape and reel specifications,
NTR4170NT1G
NTR4170NT3G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
SIMPLIFIED SCHEMATIC − N−CHANNEL
V
Device
(BR)DSS
1
30 V
CASE 318
STYLE 21
SOT−23
TRE
M
G
(Note: Microdot may be in either location)
2
ORDERING INFORMATION
G
http://onsemi.com
3
110 mW @ 2.5 V
= Specific Device Code
= Date Code
= Pb−Free Package
70 mW @ 4.5 V
55 mW @ 10 V
R
(Pb−Free)
(Pb−Free)
Package
SOT−23
SOT−23
DS(on)
MARKING DIAGRAM/
Publication Order Number:
PIN ASSIGNMENT
D
MAX
1
Gate
1
S
10000/Tape & Reel
TREMG
3000/Tape & Reel
Drain
3
G
Shipping
NTR4170N/D
Source
I
D
2
3.2 A
2.8 A
2.0 A
MAX

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NTR4170NT1G Summary of contents

Page 1

... I 0. 260 T °C L Symbol Max Unit Device R 260 °C/W qJA NTR4170NT1G R 153 qJA R 100 NTR4170NT3G qJA †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 http://onsemi.com R MAX ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On−Resistance Forward Transconductance CHARGES, CAPACITANCES AND GATE ...

Page 3

V 4.5 V 2.5 V 3.0 2.0 V 2.5 2.0 1.5 1.0 0 0.5 1.0 1.5 2 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.12 0.10 0.08 0.06 0.04 0.02 1.0 2.0 3.0 ...

Page 4

C iss 400 300 200 100 C oss C rss 0 0 4.0 8 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 3 ...

Page 5

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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