IRF6711STRPBF International Rectifier, IRF6711STRPBF Datasheet - Page 3

• Manufacturer Part Number: IRF6711STRPBF
• Description: MOSFET N-CH 25V 19A DIRECTFET-SQ
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6711STRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 3.8 mOhm @ 19A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 19A
• Vgs(th) (max) @ Id: 2.35V @ 25µA
• Gate Charge (qg) @ Vgs: 20nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 1810pF @ 13V
• Power - Max: 2.2W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric SQ
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 6.5 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 84 A
• Power Dissipation: 42 W
• Gate Charge Qg: 13 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ˆ
‰
P
P
P
T
T
T
R
R
R
R
R
Notes:
Absolute Maximum Ratings
Thermal Resistance
ƒ Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
0.001
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
1E-005
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
SINGLE PULSE
( THERMAL RESPONSE )
D = 0.50
0.01
0.02
0.05
0.20
0.10
0.0001
fl
f
jl
kl
l
Parameter
Parameter
0.001
Ã
t 1 , Rectangular Pulse Duration (sec)
‰
small clip heatsink (still air)
0.01
τ
Š
J
τ
J
τ
1
Ci= τi/Ri
τ
R
1
Ci= τi/Ri
θ
is measured at
0.1
R
1
R
1
τ
2
τ
R
2
2
R
2
with
1
R
τ
3
3
T
R
τ
3
3
J
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Typ.
12.5
of approximately 90°C.
τ
–––
–––
1.0
A
20
τ
A
Ri (°C/W)
5.276
30.637
22.09
-40 to + 150
10
footprint full size board with
metalized back and with small
clip heatsink (still air)
Max.
0.017
‰ Mounted on minimum
270
2.2
1.4
42
0.00315
0.75858
36.9
τi (sec)
100

Max.
–––
–––
–––
3.0
58
1000
Units
Units
°C/W
W/°C
°C
W
3