IRF6712STRPBF International Rectifier, IRF6712STRPBF Datasheet - Page 3

• Manufacturer Part Number: IRF6712STRPBF
• Description: MOSFET N-CH 25V 17A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r
• Type: Power MOSFETr

Specifications of IRF6712STRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 4.9 mOhm @ 17A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 17A
• Vgs(th) (max) @ Id: 2.4V @ 50µA
• Gate Charge (qg) @ Vgs: 18nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 1570pF @ 13V
• Power - Max: 2.2W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric SQ
• Transistor Polarity: N Channel
• Continuous Drain Current Id: 17A
• Drain Source Voltage Vds: 25V
• On Resistance Rds(on): 3.8mohm
• Rds(on) Test Voltage Vgs: 10V
• Threshold Voltage Vgs Typ: 1.9V
• Rohs Compliant: Yes
• Resistance Drain-source Rds (on): 8.7 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 17 A
• Power Dissipation: 36 W
• Gate Charge Qg: 13 nC
• Number Of Elements: 1
• Polarity: N
• Channel Mode: Enhancement
• Drain-source On-res: 0.0049Ohm
• Drain-source On-volt: 25V
• Gate-source Voltage (max): ±20V
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 6
• Package Type: Direct-FET SQ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ˆ
‰
Notes:
P
P
P
T
T
T
R
R
R
R
R
ƒ Surface mounted on 1 in. square Cu
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.05
0.20
0.10
0.01
0.02
SINGLE PULSE
( THERMAL RESPONSE )
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‰
small clip heatsink (still air)
τ
J
τ
0.01
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
Š
R
R
1
R
θ
1
is measured at
τ
2
0.1
R
τ
2
2
R
2
R
τ
3
3
with
R
τ
3
3
T
τ
1
R
4
J
τ
4
R
4
Typ.
12.5
of approximately 90°C.
–––
–––
4
1.0
20
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
R
5
τ
5
-40 to + 150
R
5
5
τ
A
footprint full size board with
metalized back and with small
clip heatsink (still air)
Max.
0.017
10
τ
‰ Mounted on minimum
270
A
2.2
1.4
36
Ri (°C/W)
1.61955
2.14056
22.2887
20.0457
11.9144
ƒ
Max.
–––
–––
–––
3.5
58
100
0.000126
0.001354
0.375850
7.41
99
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3