BUK9610-55A,118 NXP Semiconductors, BUK9610-55A,118 Datasheet - Page 3

• Manufacturer Part Number: BUK9610-55A,118
• Description: MOSFET N-CH 55V 75A SOT404
• Manufacturer: NXP Semiconductors
• Series: TrenchMOS™r

Specifications of BUK9610-55A,118

• Package / Case: D²Pak, TO-263 (2 leads + tab)
• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 9 mOhm @ 25A, 10V
• Drain To Source Voltage (vdss): 55V
• Current - Continuous Drain (id) @ 25° C: 75A
• Vgs(th) (max) @ Id: 2V @ 1mA
• Gate Charge (qg) @ Vgs: 68nC @ 5V
• Input Capacitance (ciss) @ Vds: 4307pF @ 25V
• Power - Max: 200W
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 55 C
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.009 Ohm @ 10 V
• Drain-source Breakdown Voltage: 55 V
• Gate-source Breakdown Voltage: +/- 15 V
• Continuous Drain Current: 75 A
• Power Dissipation: 200000 mW
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Fall Time: 139 ns
• Rise Time: 155 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934056852118; BUK9610-55A /T3; BUK9610-55A /T3

NXP Semiconductors
4. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
BUK9610-55A
Product data sheet
Symbol
V
V
V
I
I
P
T
T
Source-drain diode
I
I
Avalanche ruggedness
E
D
DM
S
SM
Fig 1.
stg
j
DS
DGR
GS
tot
DS(AL)S
Continuous current is limited by package.
Current is limited by power dissipation chip rating.
(A)
I
D
120
100
80
60
40
20
0
25
function of mounting base temperature
Normalized continuous drain current as a
Limiting values
50
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
source current
peak source current
non-repetitive drain-source
avalanche energy
75
Capped at 75 A due to package
100
125
150
All information provided in this document is subject to legal disclaimers.
175
T
mb
03nf89
(°C)
Rev. 02 — 16 February 2011
200
Conditions
T
R
V
see
V
T
see
T
T
pulsed; t
I
V
D
j
mb
mb
mb
GS
GS
GS
GS
≥ 25 °C; T
= 75 A; V
Figure 3
Figure 3
= 25 °C; pulsed; t
= 25 °C; see
= 25 °C
= 5 V; T
= 5 V; T
= 5 V; T
= 20 kΩ
p
≤ 10 µs; T
sup
j
j
j(init)
j
Fig 2.
≤ 175 °C
= 25 °C; see
= 100 °C; see
≤ 55 V; R
= 25 °C; unclamped
P
Figure 2
(%)
der
120
80
40
mb
0
p
function of mounting base temperature
Normalized total power dissipation as a
0
= 25 °C
≤ 10 µs;
GS
Figure
= 50 Ω;
Figure 1
N-channel TrenchMOS logic level FET
50
1;
BUK9610-55A
100
[1]
[2]
[1]
[2]
[1]
Min
-
-
-15
-
-
-
-
-
-55
-55
-
-
-
-
150
© NXP B.V. 2011. All rights reserved.
T
mb
175
175
Max
55
55
15
75
100
70
400
200
100
75
400
333
03aa16
(°C)
200
Unit
V
V
V
A
A
A
A
W
°C
°C
A
A
A
mJ
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