MTP50P03HDLG ON Semiconductor, MTP50P03HDLG Datasheet

MOSFET P-CH 30V 50A TO220AB

MTP50P03HDLG

Manufacturer Part Number
MTP50P03HDLG
Description
MOSFET P-CH 30V 50A TO220AB
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of MTP50P03HDLG

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
25 mOhm @ 25A, 5V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
50A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
100nC @ 5V
Input Capacitance (ciss) @ Vds
4900pF @ 25V
Power - Max
125W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.025 Ohm @ 5 V
Forward Transconductance Gfs (max / Min)
20 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
50 A
Power Dissipation
125000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.025Ohm
Drain-source On-volt
30V
Gate-source Voltage (max)
±15V
Drain Current (max)
50A
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Package Type
TO-220AB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MTP50P03HDLGOS

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MTP50P03HDL
Power MOSFET
50 Amps, 30 Volts, Logic Level
P−Channel TO−220
avalanche and commutation modes. The energy efficient design also
offers a drain−to−source diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 6
MAXIMUM RATINGS
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Drain−Source Voltage
Drain−Gate Voltage (R
Gate−Source Voltage
− Continuous
− Non−Repetitive (t
Drain Current − Continuous
Drain Current
Drain Current
Total Power Dissipation
Derate above 25°C
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
I
Thermal Resistance,
Junction−to−Case
Junction−to−Ambient, when mounted with
the minimum recommended pad size
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
L
This Power MOSFET is designed to withstand high energy in the
Fast Recovery Diode
Avalanche Energy Specified
Source−to−Drain Diode Recovery Time Comparable to a Discrete
Diode is Characterized for Use in Bridge Circuits
I
Pb−Free Package is Available*
DD
= 50 Apk, L = 1.0 mH, R
DSS
= 25 Vdc, V
and V
DS(on)
− Continuous @ 100°C
− Single Pulse (t
GS
Rating
p
J
= 5.0 Vdc, Peak
≤ 10 ms)
= 25°C
Specified at Elevated Temperature
GS
(T
= 1.0 MW)
G
C
= 25 W)
= 25°C unless otherwise noted)
Preferred Device
p
≤ 10 ms)
Symbol
T
V
V
V
R
R
J
V
E
I
GSM
P
DGR
, T
T
DSS
DM
I
I
qJC
qJA
GS
AS
D
D
D
L
stg
−55 to
Value
1250
± 15
± 20
62.5
150
125
150
260
1.0
1.0
30
30
50
31
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
W
MTP50P03HDL
MTP50P03HDLG
Preferred devices are recommended choices for future use
and best overall value.
1
2
3
Device
50 AMPERES, 30 VOLTS
M50P03HDL = Device Code
A
Y
WW
G
ORDERING INFORMATION
4
G
R
CASE 221A
TO−220AB
http://onsemi.com
DS(on)
STYLE 5
P−Channel
TO−220AB
TO−220AB
(Pb−Free)
Package
= Assembly Location
= Year
= Work Week
= Pb−Free Package
D
= 25 mW
Publication Order Number:
MARKING DIAGRAM
& PIN ASSIGNMENT
Gate
S
1
M50P03HDLG
MTP50P03HDL/D
Drain
Drain
AYWW
4
2
50 Units/Rail
50 Units/Rail
Shipping
3
Source

Related parts for MTP50P03HDLG

MTP50P03HDLG Summary of contents

Page 1

... J stg 150 E 1250 mJ AS °C/W R 1.0 qJC 62.5 R qJA °C T 260 L MTP50P03HDL MTP50P03HDLG Preferred devices are recommended choices for future use and best overall value. 1 http://onsemi.com 50 AMPERES, 30 VOLTS DS(on) P−Channel MARKING DIAGRAM & PIN ASSIGNMENT 4 Drain 4 TO−220AB CASE 221A ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage = 250 mAdc Vdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc, ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 100 T = 25° 0.2 0.4 0.6 0.8 1.0 1 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0.029 ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

... RR Compared to ON Semiconductor standard cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter t reverse recovery characteristic. The softness advantage of the high cell density diode means they can be forced through ...

Page 6

The Forward Biased Safe Operating Area curves define the maximum simultaneous drain−to−source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (T ...

Page 7

D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 1.0E−05 1.0E−04 1.0E− Figure 15. Diode Reverse Recovery Waveform MTP50P03HDL P 0.1 (pk DUTY CYCLE 1.0E−02 ...

Page 8

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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