ST7538P STMicroelectronics, ST7538P Datasheet - Page 18

• Manufacturer Part Number: ST7538P
• Description: Telecom Line Management ICs 1/2 Duplex FSK Modem
• Manufacturer: STMicroelectronics
• Type: Single Chipr

Specifications of ST7538P

• Product: Modem Chip
• Supply Voltage (max): 5.25 V, 12.5 V
• Supply Voltage (min): 4.75 V, 7.5 V
• Supply Current: 5 mA, 370 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: TQFP-44
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ST7538
Table 10. Vout vs. R1 & R2 resistors value
Notes: The rate of R2 takes in account the input resistance on the SENSE pin (36 KΩ).
Figure 16. Typical Output Current vs. Rcl
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18/30
Integrated Power Line Interface (PLI)
The Power Line Interface (PLI) is a double CMOS AB Class Power Amplifier with the two outputs
(ATOP1 and ATOP2) in opposition of phase.
Two are the possible configuration:
- Single Ended Output (ATOP1).
- Bridge Connection
The Bridge connection guarantee a Differential Output Voltage to the load with twice the swing of each
individual Output. This topology virtually eliminates the even harmonics generation.
The PLI requires, to ensure a proper operation, a regulated and well filtered Supply Voltage. PAVcc
Voltage must fulfil the following formula to work without clipping phenomena:
To allow the driving of an external Power Line Interface, the output of the ALC is available even on ATO
pin. ATO output has a current capability much lower than ATOP1 and ATOP2.
Vout (Vrms)
5.6nF capacitor effect has been neglected.
0.150
0.250
0.350
0.500
0.625
0.750
0.875
1.000
1.250
1.500
Vout (dBµV)
103.5
108.0
110.9
114.0
115.9
117.5
118.8
120.0
121.9
123.5
(mA)
Irms
325
300
275
250
225
200
175
150
125
100
PAVcc
2
2.5
≥
(R1+R2)/R2
VATOP AC
----------------------------------- -
3
10.8
1.1
1.9
2.7
3.7
4.7
5.8
6.6
7.6
9.5
2
3.5
(
)
4
+
7.5V
4.5
D01IN1311
5
R2 (KΩ)
Rcl(KΩ)
7.5
5.1
3.6
3.3
3.3
2.7
2.0
1.6
1.6
1.6
R1 (KΩ)
11.0
12.0
11.0
10.0
13.0
15.0
1.0
3.9
5.6
8.2