SI1300BDL-T1-E3 Vishay, SI1300BDL-T1-E3 Datasheet
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SI1300BDL-T1-E3
Specifications of SI1300BDL-T1-E3
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SI1300BDL-T1-E3 Summary of contents
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... V GS SC-70 (3-LEADS Marking Code Top View Ordering Information: Si1300BDL-T1-E3 (Lead (Pb)-free) Si1300BDL-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (T Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (T = 150 °C) J Pulsed Drain Current Continuous Source-Drain Diode Current Maximum Power Dissipation Operating Junction and Storage Temperature Range ...
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... Si1300BDL Vishay Siliconix SPECIFICATIONS ( °C, unless otherwise noted) J Parameter Static Drain-Source Breakdown Voltage V Temperature Coefficient DS V Temperature Coefficient GS(th) Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current a On-State Drain Current a Drain-Source On-State Resistance b Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance ...
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... Total Gate Charge (pC) g Gate Charge Document Number: 73557 S10-2139-Rev. C, 20-Sep- thru 2.0 2.5 3.0 0.75 1.00 1. 450 600 Si1300BDL Vishay Siliconix 0.8 0.6 0.4 0 ° 125 ° °C A 0.0 0.0 0.5 1.0 1 Gate-to-Source Voltage (V) GS Transfer Characteristics Curves vs. Temperature ...
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... Si1300BDL Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted 150 °C J 0.1 0.01 0.001 0.0 0.3 0 Source-to-Drain Voltage (V) SD Forward Diode Voltage vs. Temperature 1.0 0.9 0 0.7 0.6 0.5 0.4 0.3 0 Temperature (°C) J Threshold Voltage www.vishay.com °C J 0.9 1.2 1.5 = 250 µA ...
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... Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?73557. Document Number: 73557 S10-2139-Rev. C, 20-Sep- Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient - Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot Si1300BDL Vishay Siliconix Notes Duty Cycle Per Unit Base = R = 360 ° ...
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