NTZD5110NT1G ON Semiconductor, NTZD5110NT1G Datasheet

MOSFET N-CH DUAL 60V SOT563-6

NTZD5110NT1G

Manufacturer Part Number
NTZD5110NT1G
Description
MOSFET N-CH DUAL 60V SOT563-6
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTZD5110NT1G

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
1.6 Ohm @ 500mA, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
294mA
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
0.7nC @ 4.5V
Input Capacitance (ciss) @ Vds
24.5pF @ 20V
Power - Max
250mW
Mounting Type
Surface Mount
Package / Case
SOT-563, SOT-6
Configuration
Dual
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.6 Ohm @ 10 V
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.294 A
Power Dissipation
250 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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NTZD5110N
Small Signal MOSFET
60 V, 310 mA, Dual N−Channel
with ESD Protection, SOT−563
Features
Applications
© Semiconductor Components Industries, LLC, 2010
September, 2010 − Rev. 5
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Gate−Source ESD Rating (HBM, Method 3015)
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 5 s (Note 1)
Low R
Low Threshold Voltage
ESD Protected Gate
Small Footprint 1.6 x 1.6 mm
These are Pb−Free Devices
Load/Power Switches
Driver Circuits: Relays, Lamps, Displays, Memories, etc.
Battery Management/Battery Operated Systems
Cell Phones, Digital Cameras, PDAs, Pagers, etc.
(Cu. area = 1.127 in sq [1 oz] including traces).
DS(on)
Improving System Efficiency
Parameter
Parameter
(T
J
Steady
tv5 s
= 25°C unless otherwise noted.)
State
Steady State
t
p
t v 5 s
= 10 ms
T
T
T
T
A
A
A
A
= 25°C
= 85°C
= 25°C
= 85°C
Symbol
Symbol
V
T
ESD
R
V
I
P
P
T
DSS
STG
T
I
I
DM
I
qJA
GS
D
D
S
J
D
D
L
,
−55 to
Value
1800
Max
±20
294
212
250
310
225
280
590
150
350
260
500
447
60
1
°C/W
Unit
Unit
mW
mW
mA
mA
mA
mA
°C
°C
V
V
V
G1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
V
(BR)DSS
60
(Note: Microdot may be in either location)
D
G
S
6
2
CASE 463A
1
1
SOT−563
ORDERING INFORMATION
1
2
3
S7 = Specific Device Code
M
D1
S1
1
http://onsemi.com
PINOUT: SOT−563
= Date Code
R
2.5 W @ 4.5 V
1.6 W @ 10 V
DS(on)
Top View
N−Channel
MAX
MOSFET
Publication Order Number:
G2
MARKING
DIAGRAM
S7MG
NTZD5110N/D
6
5
4
G
310 mA
D2
S2
I
D
S
D
G
2
1
2
Max

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NTZD5110NT1G Summary of contents

Page 1

NTZD5110N Small Signal MOSFET 60 V, 310 mA, Dual N−Channel with ESD Protection, SOT−563 Features • Low R Improving System Efficiency DS(on) • Low Threshold Voltage • ESD Protected Gate • Small Footprint 1.6 x 1.6 mm • These are ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES AND CAPACITANCES ...

Page 3

9.0 V 8.0 V 1.2 7.0 V 6.0 V 0.8 0 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 125°C ...

Page 4

... Figure 7. Capacitance Variation 10 1 0.1 0.01 0.4 Figure 9. Diode Forward Voltage vs. Current ORDERING INFORMATION Device NTZD5110NT1G NTZD5110NT5G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe- cifications Brochure, BRD8011/D. TYPICAL CHARACTERISTICS ...

Page 5

... M *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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