BUP213 Infineon Technologies, BUP213 Datasheet
BUP213
Specifications of BUP213
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BUP213 Summary of contents
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... Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, L 7141-M, Edition 2, 03.09.2003 This chip is used for: BUP 213 Applications: drives I Die Size Cn 2 15A 5 ...
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... Output capacitance Reverse transfer capacitance SWITCHING CHARACTERISTICS (tested at component), Inductive Load Parameter Turn-on delay time Rise time Turn-off delay time Fall time 1) values also influenced by parasitic L- and C- in measurement and package. Edited by INFINEON Technologies HV3, L 7141-M, Edition 2, 03.09.2003 Symbol jmax C I jmax ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7141-M, Edition 2, 03.09.2003 SIGC25T120C ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7141-M, Edition 2, 03.09.2003 SIGC25T120C BUP213 Package TO220 ...