STPS1L60 STMicroelectronics, STPS1L60 Datasheet - Page 4
![DIODE SCHOTTKY LDO 1A 60V DO-41](/photos/5/36/53643/497-do-41__axial_series_sml.jpg)
STPS1L60
Manufacturer Part Number
STPS1L60
Description
DIODE SCHOTTKY LDO 1A 60V DO-41
Manufacturer
STMicroelectronics
Datasheet
1.STPS1L60A.pdf
(10 pages)
Specifications of STPS1L60
Voltage - Forward (vf) (max) @ If
570mV @ 1A
Voltage - Dc Reverse (vr) (max)
60V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
50µA @ 60V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Through Hole
Package / Case
DO-204AL, DO-41, Axial
Product
Schottky Rectifiers
Peak Reverse Voltage
60 V
Forward Continuous Current
1 A
Max Surge Current
40 A
Configuration
Single
Forward Voltage Drop
0.75 V at 2 A
Maximum Reverse Leakage Current
50 uA
Operating Temperature Range
+ 150 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STPS1L60
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
STPS1L60A
Manufacturer:
STMicroelectronics
Quantity:
55 714
Company:
Part Number:
STPS1L60A
Manufacturer:
TI
Quantity:
5 437
Company:
Part Number:
STPS1L60RL
Manufacturer:
ST
Quantity:
7 463
Company:
Part Number:
STPS1L60U
Manufacturer:
STMicroe
Quantity:
30 000
Characteristics
4/10
Figure 7.
Figure 9.
Figure 11. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
18
16
14
12
10
7
6
5
4
3
2
1
0
1.E-04
1.E-02
8
6
4
2
0
I M (A)
Z th(j-a) /R th(j-a)
I M (A)
I M
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
δ = 0.5
δ = 0.5
Single pulse
t
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
impedance junction to ambient
versus pulse duration (DO-41)
1.E-03
1.E-03
1.E+00
1.E-02
1.E-02
t(s)
t(s)
1.E+01
1.E-01
1.E-01
1.E+02
STmite flat
T a = 125 °C
T c = 125 °C
T a = 25 °C
T a = 75 °C
T c = 25 °C
T c = 75 °C
SMA
DO-41
t p (s)
Doc ID 7504 Rev 8
1.E+00
1.E+00
1.E+03
Figure 8.
Figure 10. Relative variation of thermal
Figure 12. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
8
7
6
5
4
3
2
1
0
1.E-02
1.E-02
I M (A)
Z th(j-a) /R th(j-a)
Z th(j-a) /R th(j-a)
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Single pulse
δ = 0.5
Single pulse
1.E-01
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
impedance junction to ambient
versus pulse duration (SMA)
impedance junction to ambient
versus pulse duration (STmite flat)
1.E-03
1.E+00
1.E+00
1.E-02
t(s)
1.E+01
1.E+01
1.E-01
1.E+02
1.E+02
STmite flat
T a = 25 °C
T a = 125 °C
T a = 75 °C
STPS1L60
DO-41
SMA
t p (s)
t p (s)
1.E+00
1.E+03
1.E+03