IDB09E60 Infineon Technologies, IDB09E60 Datasheet
IDB09E60
Specifications of IDB09E60
Related parts for IDB09E60
IDB09E60 Summary of contents
Page 1
... MSL1 Rev.2.2 Ordering Code - = 25 °C, unless otherwise specified Symbol FSM I FRM Page 1 Product Summary V RRM jmax PG-TO263-3-2 1 Marking Pin 1 PIN 2 D09E60 NC Value 600 RRM 19 29.5 tot 57.7 32.7 -55...+175 T stg 245 IDB09E60 600 1.5 V 175 ° PIN Unit °C °C 2007-09-01 ...
Page 2
... Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.2.2 Symbol R thJC R thJA R thJA = 25 °C, unless otherwise specified j Symbol Page 2 IDB09E60 Values Unit min. typ. max 2.6 K ...
Page 3
... Symbol t rr =25°C j =125°C j =150° rrm =25°C j =125°C j =150° =25°C j =125°C j =150° =25°C j =125°C j =150°C j Page 3 IDB09E60 Values Unit min. typ. max 110 - - 112 - 343 - - 585 - - 612 ...
Page 4
... Rev.2.2 2 Diode forward current I = f(T F parameter 125 °C 175 Typ. diode forward voltage 1.6 1.4 1.2 1 Page ≤ 175° 100 125 ) j 2 18A 9A 4,5A 1 -60 - IDB09E60 °C 175 T C 100 °C 160 T j 2007-09-01 ...
Page 5
... V 700 800 A/µs 1000 di /dt F Page 5 /dt 400V 125 ° 18A 9A 4.5A 200 300 400 500 600 700 /dt 400V 125° 200 300 400 500 600 700 IDB09E60 800 A/µs 1000 di /dt F 18A 9A 4.5A 800 A/µs 1000 di /dt F 2007-09-01 ...
Page 6
... Max. transient thermal impedance thJC p parameter : IDP09E60 10 K single pulse - Rev.2 0.50 0.20 0.10 0.05 0.02 0. Page 6 IDB09E60 2007-09-01 ...
Page 7
... Rev.2.2 Page 7 IDB09E60 2007-09-01 ...
Page 8
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev.2.2 Page 8 IDB09E60 2007-09-01 ...