CUS02(TE85L,Q) Toshiba, CUS02(TE85L,Q) Datasheet
CUS02(TE85L,Q)
Manufacturer Part Number
CUS02(TE85L,Q)
Description
DIODE SCHOTTKY 1A 30V US-FLAT
Manufacturer
Toshiba
Datasheet
1.CUS02TE85LQ.pdf
(5 pages)
Specifications of CUS02(TE85L,Q)
Voltage - Forward (vf) (max) @ If
470mV @ 1A
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
100µA @ 30V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Surface Mount
Package / Case
*
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
1 A
Max Surge Current
20 A
Configuration
Single
Forward Voltage Drop
0.45 V at 0.7 A
Maximum Reverse Leakage Current
100 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CUS02(TE85L,Q)
Manufacturer:
SEK
Quantity:
3 000
Part Number:
CUS02(TE85L,Q)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
•
•
•
•
Absolute Maximum Ratings
Electrical Characteristics
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for high-density board assembly due to the use of a small
surface-mount package, US−FLAT
Repetitive peak reverse voltage
Average forward current
Peak one cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Note 1: Ta = 52°C:
Note 2: Using continuously under heavy loads (e.g. the application of
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Characteristics
Characteristics
FM
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
Land size: 6 mm × 6 mm
Rectangular waveform (α = 180°), V
= 0.45 V@I
F (AV)
(Ta = 25°C)
= 1.0 A
F
RRM
TM
(Ta = 25°C)
= 0.7 A
I
I
R
Symbol
Symbol
V
V
V
R
RRM (1)
RRM (2)
I
V
F (AV)
I
th (j-
FM (1)
FM (2)
FM (3)
T
th (j-a)
FSM
RRM
C
T
= 30 V
stg
j
j
ℓ
)
CUS02
I
I
I
V
V
V
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
Junction to lead of cathode side
FM
FM
FM
RRM
RRM
R
−40 to 150
−40 to 150
20 (50 Hz)
= 10 V, f = 1.0 MHz
= 0.1 A
= 0.7 A
= 1.0 A
Rating
1.0
= 5 V
= 30 V
30
1
(Note 1)
R
Test Condition
= 15 V
Unit
°C
°C
V
A
A
Weight: 0.004 g (typ.)
JEDEC
JEITA
TOSHIBA
0.6 ± 0.1
0.6 ± 0.1
① ANODE
② CATHODE
Min
―
―
―
―
―
―
―
―
―
0.88 ± 0.1
1.25
+ 0.2
− 0.1
Typ.
0.35
0.42
0.47
0.7
10
40
―
―
―
3-2B1A
①
②
2008-05-13
―
―
Max
0.45
0.6 ± 0.1
100
150
75
30
―
―
―
―
CUS02
0.78 ± 0.1
Unit: mm
0.88 ± 0.1
0.13
°C/W
°C/W
Unit
μA
pF
V
+ 0.05
− 0.03
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CUS02(TE85L,Q) Summary of contents
Page 1
... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ...
Page 2
Marking Abbreviation Code Part No. 2 CUS02 Standard Soldering Pad 2.0 1.1 Handling Precaution Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high ...
Page 3
150°C 1 75°C 100°C 25°C 0.1 0.01 0.0 0.2 0.4 0.6 0.8 Instantaneous forward voltage max – (AV) 160 Device mounted on a ceramic board (board ...
Page 4
Surge forward current (non-repetitive Number of cycles I – 100 Pulse test 0 ...
Page 5
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...