STPS15L25D STMicroelectronics, STPS15L25D Datasheet
STPS15L25D
Specifications of STPS15L25D
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STPS15L25D Summary of contents
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... Rth July 2003 - 150 °C 0.35 V STPS15L25D PAK, this device is Parameter Tc = 145° 10ms Sinusoidal tp = 2µs square F=1kHz tp = 100µs square tp = 1µ 25°C STPS15L25D TO-220AC D PAK STPS15L25G Value 0.5 15 250 1 4 9000 - 150 ...
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... STPS15L25D/G THERMAL RESISTANCES Symbol R Junction to case th(j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters I * Reverse leakage current R * Forward voltage drop V F Pulse test : * tp = 380 µs, < evaluate the maximum conduction losses use the following equation : 0. 0.0073 I F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current ...
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... Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS15L25G only) Rth(j-a) (°C/ 1.0 1.2 1.4 STPS15L25D/G t(s) Single pulse 1.0E-3 1.0E-2 1.0E-1 VR( S(Cu) (cm² =tp/T tp 1.0E+0 F=1MHz Tj=25°C 20 ...
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... STPS15L25D/G PACKAGE MECHANICAL DATA 2 D PAK 2.0 MIN. FLAT ZONE FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 3.70 8.90 4/5 REF COOLING n (METHOD C) 5.08 1.30 DIMENSIONS Millimeters Inches Min. Max. Min. 4.40 4.60 0.173 2.49 2.69 0.098 0.03 0.23 0.001 0.70 0.93 ...
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... Diam. I Package TO-220AC 2 D PAK 2 D PAK STMicroelectronics GROUP OF COMPANIES http://www.st.com STPS15L25D/G DIMENSIONS Millimeters Inches Min. Max. Min. 4.40 4.60 0.173 1.23 1.32 0.048 2.40 2.72 0.094 0.49 0.70 0.019 0.61 0.88 0.024 1.14 1.70 0.044 4.95 5.15 0.194 10.00 10 ...