STPS2H100U STMicroelectronics, STPS2H100U Datasheet - Page 5

• Manufacturer Part Number: STPS2H100U
• Description: DIODE SCHOTTKY 2A 100V SMB
• Manufacturer: STMicroelectronics

Specifications of STPS2H100U

• Voltage - Forward (vf) (max) @ If: 790mV @ 2A
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 2A
• Current - Reverse Leakage @ Vr: 1µA @ 100V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Rectifier Type: Schottky Diode
• Configuration: Single
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 2A
• Rev Curr: 1uA
• Peak Non-repetitive Surge Current (max): 75A
• Forward Voltage: 0.88@4AV
• Operating Temp Range: -65C to 175C
• Package Type: SMB
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-6580-2; STPS2H100U

STPS2H100
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead
Figure 13. Forward voltage drop versus
Figure 15. Thermal resistance junction to
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0
0.0
I
R
FM
th(j-a)
(A)
0.1
0.5
(°C/W)
0.2
(SMB flat)
forward current (low level)
ambient versus copper surface
under each lead (SMA)
(Maximum values)
(Maximum values)
1.0
T
T
0.3
j
j
(Typical values)
(Typical values)
=125°C
=125°C
T
T
j
j
=125°C
=125°C
1.5
0.4
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
2.0
0.5
S
CU
0.6
2.5
(cm²)
110
100
90
80
70
60
50
40
30
20
10
0.7
V
0
3.0
0.0
FM
R
(Maximum values)
th(j-a)
(V)
0.8
T
j
=25°C
3.5
0.5
(°C/W)
0.9
4.0
1.0
1.0
SMA
4.5
Doc ID 6115 Rev 7
1.5
1.1
Epoxy printed circuit board FR4,
SMB flat
Copper thickness = 35 µm
1.2
5.0
2.0
S
CU
2.5
Figure 14. Forward voltage drop versus
Figure 16. Thermal resistance junction to
(cm²)
110
100
100
10
90
80
70
60
50
40
30
20
10
0
1
3.0
0.0
0.4 0.5
R
I
FM
th(j-a)
(A)
3.5
0.5
(Typical values)
(Typical values)
(°C/W)
0.6
T
T
j
j
=125°C
=125°C
(Maximum values)
(Maximum values)
4.0
forward current (high level)
ambient versus copper surface
under each lead (SMB)
1.0
T
T
0.7
j
j
=125°C
=125°C
0.8 0.9
4.5
1.5
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
(Maximum values)
5.0
2.0
T
1.0
S
j
=25°C
CU
1.1
2.5
(cm²)
1.2
3.0
V
1.3 1.4
FM
3.5
(V)
Characteristics
1.5
4.0
1.6
SMB
4.5
1.7
1.8
5.0
5/10