STPS340U STMicroelectronics, STPS340U Datasheet - Page 5

• Manufacturer Part Number: STPS340U
• Description: DIODE SCHOTTKY 40V 3A SMB
• Manufacturer: STMicroelectronics

Specifications of STPS340U

• Voltage - Forward (vf) (max) @ If: 630mV @ 3A
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io): 3A
• Current - Reverse Leakage @ Vr: 20µA @ 40V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 3 A
• Max Surge Current: 75 A
• Configuration: Single
• Forward Voltage Drop: 0.84 V @ 6 A
• Maximum Reverse Leakage Current: 20 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2465-2

STPS340
Figure 13. Relative variation of thermal
Figure 15. Junction capacitance versus
Figure 17. Thermal resistance junction to
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1000
100
90
80
70
60
50
40
30
20
10
100
1.E-04
10
0
0.0
Z
R
1
th(j-l)
C(pF)
Single pulse
th(j-a)
SMB flat
0.5
/R
(°C/W)
th(j-l)
1.E-03
impedance junction to lead
versus pulse duration - SMB flat
reverse voltage applied (typical
values)
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
1.0
1.5
1.E-02
2.0
S
CU
t (s)
p
V (V)
2.5
R
10
(cm²)
CU
1.E-01
= 35 µm) (DPAK)
3.0
3.5
1.E+00
4.0
V
OSC
F=1MHz
T =25°C
=30mV
j
DPAK
4.5
RMS
1.E+01
100
5.0
Figure 14. Reverse leakage current versus
Figure 16. Forward voltage drop versus
Figure 18. Thermal resistance junction to
1.E+01
1.E+00
10
110
100
1.E-01
1.E-02
1.E-03
1.E-04
1
0
0
90
80
70
60
50
40
30
20
10
0.0
0
0.0
I
R
FM
th(j-a)
0
(Typical values)
(Typical values)
I (mA)
(A)
R
(Maximum values)
0.1
T
T
0.5
j
j
=125°C
=125°C
T
(°C/W)
j
=125°C
5
0.2
reverse voltage applied (typical
values)
forward current
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
(SMB / SMC)
1.0
10
0.3
1.5
0.4
2.0
15
T
T
T
T
T
S
j
j
j
=150°C
=125°C
=100°C
j
j
=75°C
=25°C
CU
V (V)
0.5
2.5
(cm²)
R
CU
20
V
(Maximum values)
FM
= 35 µm)
0.6
3.0
T
j
=25°C
(V)
25
0.7
3.5
Characteristics
30
0.8
4.0
SMB / SMC
35
0.9
4.5
1.0
5.0
40
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