1PS66SB82,115 NXP Semiconductors, 1PS66SB82,115 Datasheet
1PS66SB82,115
Specifications of 1PS66SB82,115
1PS66SB82 T/R
934058746115
Related parts for 1PS66SB82,115
1PS66SB82,115 Summary of contents
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low C Rev. 04 — 13 January 2010 1. Product profile 1.1 General description Epitaxial low capacitance Schottky barrier diodes encapsulated in very small SMD plastic packages. Table 1. Type number 1PS66SB82 1PS88SB82 1.2 ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number 1PS66SB82 1PS88SB82 4. Marking Table 5. Type number 1PS66SB82 1PS88SB82 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] For Schottky barrier diodes thermal run-away has to be considered some applications the reverse power losses P power losses P [2] Refer to SOT666 standard mounting conditions. [3] Reflow soldering is the only recommended soldering method. [4] Refer to SOT363 (SC-88) standard mounting conditions. ...
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... NXP Semiconductors (mA (2) (1) ( 0.4 0.8 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values dif (Ω − ° kHz; T amb Fig 3. Differential diode forward resistance as a function of forward current; typical values ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 5. Package outline SOT666 1PS66SB82_1PS88SB82_4 Product data sheet 1PS66SB82; 1PS88SB82 scale 1.3 1.7 ...
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... NXP Semiconductors Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 6. Package outline SOT363 (SC-88) 1PS66SB82_1PS88SB82_4 Product data sheet 1PS66SB82; 1PS88SB82 scale 2.2 1.35 2 ...
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... NXP Semiconductors 9. Packing information Table 9. Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. Type number Package 1PS66SB82 SOT666 1PS88SB82 SOT363 [1] For further information and the availability of packing methods see 1PS66SB82_1PS88SB82_4 Product data sheet 1PS66SB82; 1PS88SB82 ...
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... Product data sheet 1PS66SB82; 1PS88SB82 Data sheet status Product data sheet This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Table 3 “Pinning”: updated Figure 5 “Package outline SOT666” ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 7 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Legal information ...