BAS516,315 NXP Semiconductors, BAS516,315 Datasheet - Page 14

• Manufacturer Part Number: BAS516,315
• Description: DIODE SW HI-SPEED SGL SC-79
• Manufacturer: NXP Semiconductors

Specifications of BAS516,315

• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 250mA (DC)
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Capacitance @ Vr, F: 1pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934055217315

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 23. Reflow soldering footprint BAS16VV (SOT666)
Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88)
2
1.7
1.075
2.35
Reflow soldering is the only recommended soldering method.
0.538
1.5
(4 )
0.6
0.55
(2 )
(4 )
0.5
Rev. 05 — 25 August 2008
0.45
(4 )
(4 )
0.5
(4 )
(4 )
0.5
0.6
2.65
1.8
2.75
2.45
2.1
1.6
1.7
(2 )
0.6
0.65
(2 )
(2 )
0.6
0.4 (2 )
(6 )
0.4
0.325
0.25
(2 )
(4 )
High-speed switching diodes
0.375
BAS16 series
(2 )
(4 )
0.3
Dimensions in mm
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
solder lands
placement area
solder paste
occupied area
sot666_fr
14 of 20