CPC5622 Clare, CPC5622 Datasheet - Page 18

• Manufacturer Part Number: CPC5622
• Description: LITELINK III, Full-wave Ring Detect
• Manufacturer: Clare

7.2 Tape and Reel Packaging
Figure 18.
7.3 Manufacturing Assembly Processes
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LITELINK using IPC/JEDEC standard J-STD-020.
Moisture uptake from atmospheric humidity occurs by
diffusion. During the solder reflow process, in which
the component is attached to the PCB, the whole body
of the component is exposed to high process
temperatures. The combination of moisture uptake
and high reflow soldering temperatures may lead to
moisture induced delamination and cracking of the
component. To prevent this, this component must be
handled in accordance with IPC/JEDEC standard
J-STD-020 per the labelled moisture sensitivity level
(MSL), level 3.
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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Embossed Carrier
Tape and Reel Dimensions
330.2 DIA.
(13.00 DIA)
Top Cover
Tape Thickness
.102 MAX.
(.004 MAX)
Embossment
www.clare.com
Top Cover
K = 2.70
K = 4.90
Tape
1
1
(0.106)
(0.193)
7.3.2 Reflow Profile
Recommended soldering processes are limited to
245°C component body temperature for 10 seconds.
7.3.3 Washing
Ultrasonic cleaning of LITELINK will cause permanent
damage to the device. Clare does not recommend
ultrasonic cleaning or the use of chlorinated solvents.
P = 12.00
(0.172)
Feed Direction
Specification: DS-CPC5622 - Rev. 1.0
Copyright © 2005, Clare, Inc.
LITELINK
All rights reserved. Printed in USA.
2/18/2005
A = 10.90
0
®
(0.430)
Dimensions
is a registered trademark of Clare, Inc.
(inches)
mm
B = 10.70
0
(0.421)
W = 16.30 MAX
(0.642 MAX)
CPC5622
18