STTH1R02A STMicroelectronics, STTH1R02A Datasheet - Page 5

• Manufacturer Part Number: STTH1R02A
• Description: DIODE ULTRA FAST 200V 1.5A SMA
• Manufacturer: STMicroelectronics

Specifications of STTH1R02A

• Voltage - Forward (vf) (max) @ If: 1V @ 1.5A
• Voltage - Dc Reverse (vr) (max): 200V
• Current - Average Rectified (io): 1.5A
• Current - Reverse Leakage @ Vr: 3µA @ 200V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30ns
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Other names: 497-5254-1

STTH1R02
Figure 11. Peak reverse recovery curent
Figure 13. Thermal resistance, junction to
Figure 15. Thermal resistance, junction to
120
100
8
7
6
5
4
3
2
1
0
100
80
60
40
20
10
90
80
70
60
50
40
30
20
10
0
0
0.0
0
V
I
F
R
=1.5A
=160V
0.5
versus dI
ambient, versus copper surface
under each lead - SMA (Epoxy FR4,
copper thickness = 35 µm)
ambient, versus copper surface
under each lead - DO 15 (Epoxy
FR4, copper thickness = 35 µm)
1.0
1
1.5
2.0
2
F
/dt (typical values)
T
100
j
=125°C
2.5
3.0
3
T
j
3.5
=25°C
4.0
4
dI
F
S
/dt(A/µs)
S
CU
CU
(cm²)
(cm²)
4.5
DO-15
SMA
1000
5.0
5
Figure 12. Dynamic parameters versus
Figure 14. Thermal resistance, junction to
Figure 16. Thermal resistance, junction to
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
110
100
100
90
80
70
60
50
40
30
20
10
90
80
70
60
50
40
30
20
10
0
0
25
0.0
0
V
I
F
R
=1.5A
=160V
0.5
1
junction temperature
ambient, versus copper surface
under each lead - SMB (Epoxy FR4,
copper thickness = 35 µm)
ambient, versus copper surface
under each lead - DO-41 (Epoxy
FR4, copper thickness = 35 µm)
50
1.0
2
I
RM
1.5
3
Q
RR
75
2.0
4
S
S(cm²)
CU
2.5
(cm²)
5
100
3.0
6
3.5
7
Characteristics
125
4.0
8
T
j
(°C)
DO-41
4.5
9
SMB
150
5.0
10
5/10