STPS10L25D STMicroelectronics, STPS10L25D Datasheet
STPS10L25D
Specifications of STPS10L25D
Available stocks
Related parts for STPS10L25D
STPS10L25D Summary of contents
Page 1
... Rth July 2003 - 150 °C 0. REVERSE TO-220AC STPS10L25D Parameter Tc = 140° Sinusoidal tp=2 µs square F=1kHz tp = 100 µs square tp = 1µ 25°C STPS10L25D PAK STPS10L25G Value 0.5 10 200 1 3 5500 - 150 150 10000 ...
Page 2
... STPS10L25D/G THERMAL RESISTANCE Symbol R Junction to case th (j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions I * Reverse leakage current Forward voltage drop F Pulse test 380 µs, < evaluate the maximum conduction losses use the following equation : 0. 0.013 I F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current ...
Page 3
... C(nF) 5.0 1.0 0 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS10L25G only) Rth(j-a) (°C/ STPS10L25D/G = 0.5 = 0.2 = 0.1 tp(s) Single pulse 1E-3 1E-2 1E-1 VR( S(Cu) (cm² =tp/T ...
Page 4
... STPS10L25D/G PACKAGE MECHANICAL DATA 2 D PAK FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 8.90 4/5 REF Cooling method: by conduction (method C) n 5.08 1.30 3.70 DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 ...
Page 5
... Diam. I Package TO-220AC 2 D PAK 2 D PAK STMicroelectronics GROUP OF COMPANIES http://www.st.com STPS10L25D/G DIMENSIONS Millimeters Inches Min. Max. Min. 4.40 4.60 0.173 1.23 1.32 0.048 2.40 2.72 0.094 0.49 0.70 0.019 0.61 0.88 0.024 1.14 1.70 0.044 4.95 5.15 0.194 10.00 10 ...