STPS1L30MF STMicroelectronics, STPS1L30MF Datasheet - Page 5

• Manufacturer Part Number: STPS1L30MF
• Description: DIODE SCHOTTKY 30V 1A DO222AA
• Manufacturer: STMicroelectronics

Specifications of STPS1L30MF

• Voltage - Forward (vf) (max) @ If: 390mV @ 1A
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 390µA @ 30V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-222AA
• Very Low Profile Package: 0.85 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Other names: 497-8026-2; STPS1L30MF

STPS1L30MF
2
Package information
Table 4.
Figure 12. STmite flat recommended footprint (all dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
E1
E
STmite flat dimensions
c
D
b
0.65
L3
L
0.85 0.63
L1
A
L2
4.13
2.00
b2
Ref.
E1
b2
L1
L2
L3
A
D
E
b
L
c
0.65
Min.
0.80
0.40
0.70
0.10
1.75
3.60
2.80
0.50
2.10
0.45
0.20
Millimeters
0.95
Typ.
0.85
0.55
0.85
0.15
1.90
3.80
2.95
0.55
2.40
0.60
0.35
1.95
Dimensions
Max.
0.95 0.031 0.033 0.037
0.65 0.016 0.022 0.026
1.00 0.027 0.033 0.039
0.25 0.004 0.006 0.009
2.05 0.069 0.075 0.081
3.90 0.142 0.150 0.154
3.10 0.110 0.116 0.122
0.80 0.020 0.022 0.031
2.60 0.083 0.094 0.102
0.75 0.018 0.024 0.030
0.50 0.008 0.014 0.020
Package information
Min.
Inches
Typ.
Max.
5/7