BAT46 STMicroelectronics, BAT46 Datasheet - Page 4

• Manufacturer Part Number: BAT46
• Description: DIODE SCHOTTKY SS 100V DO35
• Manufacturer: STMicroelectronics

Specifications of BAT46

• Voltage - Forward (vf) (max) @ If: 450mV @ 10mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 150mA (DC)
• Current - Reverse Leakage @ Vr: 5µA @ 75V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 10pF @ 0V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Product: Schottky Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.15 A
• Max Surge Current: 0.75 A
• Configuration: Single
• Forward Voltage Drop: 1 V @ 0.25 A
• Maximum Reverse Leakage Current: 5 uA @ 75 V
• Operating Temperature Range: - 65 C to + 125 C
• Mounting Style: Through Hole
• Rectifier Type: Small Signal Schottky Diode
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 0.15A
• Rev Curr: 5uA
• Peak Non-repetitive Surge Current (max): 0.75A
• Forward Voltage: 1V
• Operating Temp Range: -65C to 125C
• Package Type: DO-35
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-3768-2

Characteristics
4/11
Figure 7.
Figure 9.
Figure 11. Thermal resistance junction to
1.00
0.10
0.01
600
550
500
450
400
350
300
1.E+00
1.E-01
1.E-02
1.E-02
0
0.0
Single pulse
SOT-23
5
0.1
Forward voltage drop versus
forward current (typical values,
high-level)
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
ambient versus copper surface
under each lead, epoxy FR4,
e
10
CU
1.E-01
0.2
= 35 µm (SOD-323)
15
0.3
20
0.4
t
S
P
1.E+00
(s)
CU
(mm²)
25
0.5
Tj=125 °C
30
0.6
Alumine substrate
35
1.E+01
0.7
10 x 8 x 0.5 mm
V
FM
0.8
40
(V)
Tj=25 °C
0.9
45
1.E+02
1.0
50
Figure 8.
Figure 10. Variation of thermal impedance
1.00
0.10
0.01
1000
100
10
1.E-02
1.E-02
Single pulse
Single pulse
SOD-323
SOT-323
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
e
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, e
Relative variation of thermal
CU
1.E-01
1.E-01
= 35 µm (SOD-323)
1.E+00
1.E+00
t
P
t
(s)
P
(s)
CU
= 35 µm (SOT-323)
1.E+01
1.E+01
S
CU
Epoxy FR4
e
CU
=2.25 mm²
=35 µm
BAT46 Series
1.E+02
1.E+02