PMEG1030EJ,115 NXP Semiconductors, PMEG1030EJ,115 Datasheet - Page 6

• Manufacturer Part Number: PMEG1030EJ,115
• Description: SCHOTTKY RECT 10V 3A SOD323F
• Manufacturer: NXP Semiconductors

Specifications of PMEG1030EJ,115

• Package / Case: SC-90, SOD-323F
• Voltage - Forward (vf) (max) @ If: 530mV @ 3A
• Voltage - Dc Reverse (vr) (max): 10V
• Current - Average Rectified (io): 3A (DC)
• Current - Reverse Leakage @ Vr: 3mA @ 10V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 85pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 10 V
• Forward Continuous Current: 3 A
• Max Surge Current: 9 A
• Configuration: Single
• Forward Voltage Drop: 0.53 V
• Maximum Reverse Leakage Current: 3000 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4108-2; 934058649115; PMEG1030EJ T/R; PMEG1030EJ T/R

NXP Semiconductors
10. Soldering
PMEG1030EH_EJ_4
Product data sheet
Fig 6.
Fig 7.
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
1.65
1.6
0.95
(2×)
1.1
Rev. 04 — 15 January 2010
0.50
(2×)
PMEG1030EH; PMEG1030EJ
4.4
2.9
1.6
4
3.05
2.80
2.10
1.60
10 V, 3 A ultra low V
0.50
msa433
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
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