PMEG3010EH,115 NXP Semiconductors, PMEG3010EH,115 Datasheet - Page 7

• Manufacturer Part Number: PMEG3010EH,115
• Description: SCHOTTKY RECT 30V 1A SOD123F
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PMEG3010EH,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Forward (vf) (max) @ If: 560mV @ 1A
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 1A (DC)
• Current - Reverse Leakage @ Vr: 150µA @ 30V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 70pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 1 A
• Max Surge Current: 9 A
• Configuration: Single
• Forward Voltage Drop: 0.56 V
• Maximum Reverse Leakage Current: 150 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4125-2; 934059031115; PMEG3010EH T/R; PMEG3010EH T/R

NXP Semiconductors
10. Packing information
11. Soldering
PMEG3010EH_EJ_ET_4
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG3010EH
PMEG3010EJ
PMEG3010ET
Fig 8. Reflow soldering footprint SOD123F
Fig 9. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
1.6
0.95
Package
SOD123F
SOD323F
SOT23
(2 )
1.1
0.50
(2 )
Rev. 04 — 20 March 2007
Description
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4.4
2.9
1.6
3.05
2.80
2.10
1.60
4
1 A very low V
PMEG3010EH/EJ/ET
0.50
msa433
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
Section
[1]
14.
solder lands
solder resist
occupied area
solder paste
Packing quantity
3000
-115
-115
-215
© NXP B.V. 2007. All rights reserved.
solder lands
solder resist
solder paste
occupied area
10000
-135
-135
-235
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