PMEG4005ET,215 NXP Semiconductors, PMEG4005ET,215 Datasheet
PMEG4005ET,215
Specifications of PMEG4005ET,215
934059428215
PMEG4005ET T/R
PMEG4005ET T/R
Related parts for PMEG4005ET,215
PMEG4005ET,215 Summary of contents
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PMEGxx05ET series 0.5 A very low V SOT23 package Rev. 02 — 13 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in ...
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... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol [1] Pulse test Pinning information Table 3. Pin Ordering information Table 4. Type number PMEG2005ET PMEG3005ET PMEG4005ET PMEGXX05ET_SER_2 Product data sheet 0.5 A very low V MEGA Schottky barrier rectifiers in SOT23 package F Quick reference data Parameter Conditions forward current ...
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... NXP Semiconductors 4. Marking Table 5. Type number PMEG2005ET PMEG3005ET PMEG4005ET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol [1] Pulse test: t PMEGXX05ET_SER_2 Product data sheet 0.5 A very low V MEGA Schottky barrier rectifiers in SOT23 package F Characteristics ° C unless otherwise specified. Parameter Conditions forward voltage PMEG2005ET 100 500 mA F PMEG3005ET 100 500 mA F PMEG4005ET ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 1. PMEG2005ET: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. PMEG2005ET: Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors (mA (1) (2) (3) (4) ( 0.2 0.4 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 4. PMEG3005ET: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 6. PMEG3005ET: Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors (mA (1) (2) (3) (4) ( 0.2 0.4 = 150 °C (1) T amb = 125 °C (2) T amb = 85 °C (3) T amb = 25 °C (4) T amb = −40 °C (5) T amb Fig 7. PMEG4005ET: Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 9. PMEG4005ET: Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors 8. Package outline Fig 10. Package outline SOT23 (TO-236AB) 9. Packing information Table 9. The -xxx numbers are the last three digits of the 12NC ordering code. Type number PMEG2005ET PMEG3005ET PMEG4005ET [1] For further information and the availability of packing methods, see PMEGXX05ET_SER_2 Product data sheet ...
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... NXP Semiconductors 10. Soldering Fig 11. Reflow soldering footprint SOT23 (TO-236AB) PMEGXX05ET_SER_2 Product data sheet 0.5 A very low V MEGA Schottky barrier rectifiers in SOT23 package F 2.90 2.50 2 0.85 3.00 1.30 0.85 3 1.00 3.30 Reflow soldering is the only recommended soldering method. Dimensions in mm Rev. 02 — 13 January 2010 ...
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... Revision history Document ID Release date PMEGXX05ET_SER_2 20100113 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 11 “Reflow soldering footprint SOT23 PMEGXX05ET_SER_1 20050715 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Legal information ...