BAV199LT1G ON Semiconductor, BAV199LT1G Datasheet

BAV199LT1G

Manufacturer Part Number

BAV199LT1G

Description

DIODE SWITCH DUAL 70V SOT23

Manufacturer

ON Semiconductor

Datasheet

1.BAV199LT1.pdf (3 pages)

Specifications of BAV199LT1G

Voltage - Forward (vf) (max) @ If

1.25V @ 150mA

Current - Reverse Leakage @ Vr

5nA @ 70V

Current - Average Rectified (io) (per Diode)

215mA (DC)

Voltage - Dc Reverse (vr) (max)

70V

Reverse Recovery Time (trr)

3µs

Diode Type

Standard

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Configuration

1 Pair Series Connection

Mounting Type

Surface Mount

Package / Case

SOT-23-3, TO-236-3, Micro3™, SSD3, SST3

Configuration

Dual Series

Peak Rep Rev Volt

70V

Avg. Forward Curr (max)

0.715

Rev Curr

0.005uA

Peak Non-repetitive Surge Current (max)

Forward Voltage

1.25@0.15AV

Operating Temp Range

-65C to 150C

Package Type

SOT-23

Rev Recov Time

3000ns

Operating Temperature Classification

Military

Mounting

Surface Mount

Pin Count

Product

Switching Diodes

Peak Reverse Voltage

70 V

Forward Continuous Current

0.715 A

Max Surge Current

2 A

Recovery Time

3000 ns

Forward Voltage Drop

1 V

Operating Temperature Range

- 65 C to + 150 C

Maximum Diode Capacitance

2 pF

Maximum Operating Temperature

+ 150 C

Minimum Operating Temperature

- 65 C

Mounting Style

SMD/SMT

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

BAV199LT1GOSTR

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BAV199LT1G

Dual Series Switching

Diode

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 0.75 0.062 in.

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.

August, 2009 − Rev. 6

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Reverse Voltage

Forward Current

Peak Forward Surge Current

Repetitive Peak Reverse Voltage

Average Rectified Forward Current

(Note 1)

(Averaged Over Any 20 ms Period)

Repetitive Peak Forward Current

Non−Repetitive Peak Forward Current

Total Device Dissipation

FR−5 Board (Note 1), T

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

Total Device Dissipation

Alumina Substrate (Note 2), T

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature

Compliant

Low Leakage Current Applications

Medium Speed Switching Times

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

t = 1.0 ms

t = 1.0 s

Characteristic

Rating

= 25°C

Symbol

FM(surge)

F(AV)

FRM

FSM

RRM

, T

qJA

stg

−65 to +150

Value

Max

215

500

715

450

225

556

300

417

2.0

1.0

0.5

1.8

2.4

mW/°C

mAdc

°C/W

Unit

Vdc

Adc

°C

†For information on tape and reel specifications,

BAV199LT1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*Date Code orientation and/or overbar may

Device

vary depending upon manufacturing location.

(Note: Microdot may be in either location)

ANODE

ORDERING INFORMATION

JY = Specific Device Code

M = Date Code*

MARKING DIAGRAM

http://onsemi.com

CATHODE/ANODE

= Pb−Free Package

(Pb−Free)

Package

SOT−23

CASE 318

STYLE 11

SOT−23

JY M G

Publication Order Number:

3000/Tape & Reel

CATHODE

Shipping

BAV199LT1/D

†

Related parts for BAV199LT1G

BAV199LT1G Summary of contents

Page 1

... R 556 °C/W qJA P D 300 mW 2.4 mW/°C 417 R °C/W qJA −65 to +150 °C J stg BAV199LT1G †For information on tape and reel specifications, 1 http://onsemi.com ANODE CATHODE CATHODE/ANODE CASE 318 SOT−23 STYLE 11 MARKING DIAGRAM Specific Device Code M = Date Code* = Pb−Free Package ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Reverse Breakdown Voltage (I = 100 mAdc) (BR) Reverse Voltage Leakage Current ( Vdc Vdc 150° Diode Capacitance ( 1.0 ...

Page 3

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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