BAS31,235 NXP Semiconductors, BAS31,235 Datasheet - Page 5

DIODE AVAL SW 90V 250MA SOT-23

BAS31,235

Manufacturer Part Number
BAS31,235
Description
DIODE AVAL SW 90V 250MA SOT-23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS31,235

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
900mV @ 100mA
Current - Reverse Leakage @ Vr
100nA @ 90V
Current - Average Rectified (io) (per Diode)
250mA (DC)
Voltage - Dc Reverse (vr) (max)
90V
Reverse Recovery Time (trr)
50ns
Diode Type
Avalanche
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
General Purpose Diodes
Peak Reverse Voltage
110 V
Forward Continuous Current
0.25 A
Max Surge Current
10 A
Configuration
Dual Series
Recovery Time
50 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
933723190235
BAS31 /T3
BAS31 /T3
NXP Semiconductors
GRAPHICAL DATA
2003 Mar 20
handbook, halfpage
handbook, full pagewidth
General purpose controlled avalanche
(double) diodes
Device mounted on an FR4 printed-circuit board.
(1) Single diode loaded.
(2) Double diode loaded.
Fig.2
Based on square wave currents.
T
j
I FSM
(mA)
= 25 °C prior to surge.
(A)
I F
10
300
200
100
10
10
−1
0
1
2
0
1
Maximum permissible continuous forward
current as a function of ambient
temperature.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
(1)
(2)
100
10
T amb (
o
C)
MBG440
200
10
5
2
handbook, halfpage
(1) T
(2) T
(3) T
Fig.3
(mA)
IF
600
400
200
j
j
j
0
= 150 °C; typical values.
= 25 °C; typical values.
= 25 °C; maximum values.
0
Forward current as a function of forward
voltage.
BAS29; BAS31; BAS35
(1)
10
3
(2)
1
(3)
t p (µs)
V F (V)
Product data sheet
MBH280
MBH327
10
2
4

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