BAS16VY,115 NXP Semiconductors, BAS16VY,115 Datasheet - Page 13

• Manufacturer Part Number: BAS16VY,115
• Description: DIODE SW 100V 200MA H-S SOT363
• Manufacturer: NXP Semiconductors

Specifications of BAS16VY,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 3 Independent
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 4 A
• Configuration: Triple Parallel
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 50 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934057343115; BAS16VY T/R; BAS16VY T/R

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 21. Reflow soldering footprint BAS16L (SOD882)
Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75)
0.9
Reflow soldering is the only recommended soldering method.
0.85
(2 )
(2 )
0.3
0.4
(3 )
0.6
Rev. 05 — 25 August 2008
1.3
0.7
2.2
1.3
1.7
(2 )
0.6
R0.05 (8 )
(3 )
0.5
(2 )
0.7
1
2
High-speed switching diodes
BAS16 series
Dimensions in mm
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot416_fr
sod882_fr
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