BAW56W,115 NXP Semiconductors, BAW56W,115 Datasheet - Page 3
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BAW56W,115
Manufacturer Part Number
BAW56W,115
Description
DIODE SW DBL 90V 150MA SOT-323
Manufacturer
NXP Semiconductors
Datasheet
1.BAW56S115.pdf
(15 pages)
Specifications of BAW56W,115
Package / Case
SC-70-3, SOT-323-3
Mounting Type
Surface Mount
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
4ns
Current - Reverse Leakage @ Vr
500nA @ 80V
Voltage - Forward (vf) (max) @ If
1V @ 50mA
Voltage - Dc Reverse (vr) (max)
90V
Current - Average Rectified (io) (per Diode)
150mA (DC)
Diode Configuration
1 Pair Common Anode
Product
Switching Diodes
Peak Reverse Voltage
90 V
Forward Continuous Current
0.15 A
Max Surge Current
4 A
Configuration
Dual Common Anode
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934026020115::BAW56W T/R::BAW56W T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BAW56W,115
Manufacturer:
NXP Semiconductors
Quantity:
9 600
NXP Semiconductors
3. Ordering information
4. Marking
5. Limiting values
BAV756S_BAW56_SER_5
Product data sheet
Table 4.
Table 5.
[1]
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Type number
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
Type number
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
Symbol
Per diode
V
V
I
F
RRM
R
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Ordering information
Marking codes
Limiting values
Parameter
repetitive peak reverse
voltage
reverse voltage
forward current
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
Package
Name
SC-88
-
SC-101
SC-88
SC-75
SC-70
Rev. 05 — 26 November 2007
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 3 leads
leadless ultra small plastic package; 3 solder lands;
body 1.0
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
BAV756S; BAW56 series
0.6
Conditions
T
T
T
T
T
T
s
amb
amb
s
s
amb
= 60 C
= 60 C
= 90 C
0.5 mm
Marking code
A7*
A1*
S5
A1*
A1
A1*
25 C
25 C
25 C
High-speed switching diodes
[1]
Min
-
-
-
-
-
-
-
-
© NXP B.V. 2007. All rights reserved.
Max
90
90
250
215
150
250
150
150
Version
SOT363
SOT23
SOT883
SOT363
SOT416
SOT323
Unit
V
V
mA
mA
mA
mA
mA
mA
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