MBR3045CT Vishay, MBR3045CT Datasheet - Page 6

• Manufacturer Part Number: MBR3045CT
• Description: DIODE SCHOTTKY 45V 15A TO-220AB
• Manufacturer: Vishay

Specifications of MBR3045CT

• Voltage - Forward (vf) (max) @ If: 760mV @ 30A
• Current - Reverse Leakage @ Vr: 1mA @ 45V
• Current - Average Rectified (io) (per Diode): 15A
• Voltage - Dc Reverse (vr) (max): 45V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Diode Configuration: 1 Pair Common Cathode
• Mounting Type: Through Hole
• Package / Case: TO-220-3 (Straight Leads)
• Product: Schottky Diodes
• Peak Reverse Voltage: 45 V
• Forward Continuous Current: 30 A
• Max Surge Current: 200 A
• Configuration: Dual Common Cathode
• Forward Voltage Drop: 0.76 V
• Maximum Reverse Leakage Current: 1000 uA
• Operating Temperature Range: - 65 C to + 150 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Lead free / RoHS Compliant
• Other names: *MBR3045CT; VS-MBR3045CT; VS-MBR3045CT; VSMBR3045CT; VSMBR3045CT

DIMENSIONS in millimeters and inches
Notes
(1)
(2)
(3)
(4)
(5)
(6)
Document Number: 95222
Revision: 08-Mar-11
SYMBOL
(6)
Dimensioning and tolerancing as per ASME Y14.5M-1994
Lead dimension and finish uncontrolled in L1
Dimension D, D1 and E do not include mold flash. Mold flash
shall not exceed 0.127 mm (0.005") per side. These dimensions
are measured at the outermost extremes of the plastic body
Dimension b1, b3 and c1 apply to base metal only
Controlling dimensions: inches
Thermal pad contour optional within dimensions E, H1, D2 and
E1
A1
A2
b1
b2
b3
D1
D2
c1
A
b
D
D
c
Lead tip
0.015
Q
D1
M
14.85
11.68
MIN.
MILLIMETERS
4.25
1.14
2.56
0.69
0.38
1.20
1.14
0.36
0.36
8.38
B
E2
1
A
2 x
(6)
M
e1
(7)
E
e
2
MAX.
15.25
12.88
3
4.65
1.40
2.92
1.01
0.97
1.73
1.73
0.61
0.56
9.02
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For technical questions within your region, please contact one of the following:
A
Ø P
0.167
0.045
0.101
0.027
0.015
0.047
0.045
0.014
0.014
0.585
0.330
0.460
MIN.
Detail B
L
0.014
INCHES
C
M
B
MAX.
0.183
0.055
0.115
0.040
0.038
0.068
0.068
0.024
0.022
0.600
0.355
0.507
A
M
(6)
(7)
Lead assignments
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
H1
c
NOTES
TO-220AB
4
4
4
3
6
A
A2
Seating
A
A
A1
B
plane
(7)
(8)
SYMBOL
(H1)
Dimensions E2 x H1 define a zone where stamping and
singulation irregularities are allowed
Outline conforms to JEDEC TO-220, except A2 (maximum) and
D2 (minimum) where dimensions are derived from the actual
package outline
Ø P
H1
E1
E2
e1
L1
Q
E
e
L

Conforms to JEDEC outline TO-220AB
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View A - A
(E)
10.11
13.52
MILLIMETERS
MIN.
4.88
6.86
2.41
6.09
3.32
3.54
2.60
-
90° to 93°
Outline Dimensions
Vishay Semiconductors
E1 (6)
MAX.
10.51
14.02
8.89
2.67
5.28
6.48
3.82
3.73
0.76
3.00
D2
Base metal
Thermal pad
(6)
Section C - C and D - D
0.398
0.270
0.095
0.192
0.240
0.532
0.131
0.139
0.102
MIN.
c
-
90° to 93°
C
INCHES
3 x b
1
Detail B
(b, b2)
b1, b3
C
D
MAX.
0.414
0.350
0.030
0.105
0.208
0.255
0.552
0.150
0.147
0.118
2
D
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3 x b2
3
(4)
c1
Plating
NOTES
(4)
L1 (2)
3, 6
6, 7
6
7
2
1