LTC4245IUHF Linear Technology, LTC4245IUHF Datasheet - Page 35

• Manufacturer Part Number: LTC4245IUHF
• Description: IC,Power Control/Management,CMOS,LLCC,38PIN,PLASTIC
• Manufacturer: Linear Technology

Specifications of LTC4245IUHF

• Family Name: LTC4245
• Package Type: QFN EP
• Operating Supply Voltage (min): 2.25/4.25/10.2/-10.2V
• Operating Supply Voltage (max): 0/10/20/-20V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 5mm
• Product Length (mm): 7mm
• Mounting: Surface Mount
• Pin Count: 38
• Lead Free Status / Rohs Status: Not Compliant

PACKAGE DESCRIPTIO
7.00 ± 0.10
0.75 ± 0.05
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 ± 0.05
OUTLINE M0-220 VARIATION WHKD
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
3.15 ± 0.05
(2 SIDES)
5.00 ± 0.10
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
RECOMMENDED SOLDER PAD LAYOUT
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
5.15 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
0.200 REF
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 ± 0.05
0.00 – 0.05
0.75 ± 0.05
UHF Package
5.15 ± 0.10
(2 SIDES)
0.00 – 0.05
0.200 REF
0.50 BSC
0.25 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 ± 0.05
PACKAGE
OUTLINE
3.15 ± 0.10
(2 SIDES)
R = 0.115
TYP
37
38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
LTC4245
0.40 ± 0.10
0.40 ±0.10
1
2
(UH) QFN 0205
35
4245fa